Nur Diana Izzani 个人学术档案

202320241 2

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KHAIRUL ANWAR IBRAHIMSENIOR LECTURER OF ELECTRICAL ENGINEERING, UNIVERSITI TEKNIKAL MALAYSIA MELAKA在 utem.edu.my 的电子邮件经过验证
Chin Kim GanUniversiti Teknikal Malaysia Melaka (UTeM)在 utem.edu.my 的电子邮件经过验证
Zaheera Zainal AbidinUniversiti Teknikal Malaysia Melaka (UTeM) Optimization Modelling Analytic and Simulation (OptiMAS)在 utem.edu.my 的电子邮件经过验证
SOLEHAH JASMEEUniversiti Teknikal Malaysia Melaka在 student.utem.edu.my 的电子邮件经过验证
Kyairul Azmi BaharinSenior Lecturer, Universiti Teknikal Malaysia Melaka在 utem.edu.my 的电子邮件经过验证
Ghazali OmarProfessor在 utem.edu.my 的电子邮件经过验证

Nur Diana Izzani

其他姓名NDI Masdzarif

在 student.utem.edu.my 的电子邮件经过验证


标题按引用次数排序按年份排序按标题排序	引用次数引用次数	年份
An efficient method for estimating energy losses in distribution's feeder NDI Masdzarif, KA Ibrahim, CK Gan, MT Au, KA Baharin, NA Emran, ... Bulletin of Electrical Engineering and Informatics 12 (4), 1919-1928, 2023	3	2023
Representative power distribution network: a review of available models NDI Masdzarif, KA Ibrahim, CK Gan, MT Au Bulletin of Electrical Engineering and Informatics 13 (6), 3850-3861, 2024		2024
Power loss estimation utilizing the flexibility of peak power loss regression equations based on 11 kV base case feeder NDI Masdzarif, KA Ibrahim, CK Gan, MT Au Bulletin of Electrical Engineering and Informatics 13 (6), 3880-3887, 2024		2024
Free air ball and bondability behaviours of Au-coated Ag alloy wire at various electro flame-off and bonding parameters for CMOS iBGA S Jasmee, J Palagud Jr, W SW, KI Hoo, NDI Masdzarif, TS Lim, G Omar Journal of Materials Science: Materials in Electronics 35 (22), 1502, 2024		2024
Mechanical Modelling and Analysis of CMOS Image Sensor Package TS Lim, MS Sukiman, NDI Masdzarif, S Jasmee IEEE Electronics Packaging Technology Conference, 2023		2023
Analysis on bonding wires of Au-Coated Ag alloy for IBGA automotive application J Palagud, TS Lim, S Jasmee, NDI Masdzarif, KI Hoo, SW Wang, G Omar IEEE Electronics Packaging Technology Conference, 2023		2023

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