| Survey of high-temperature reliability of power electronics packaging components R Khazaka, L Mendizabal, D Henry, R Hanna IEEE Transactions on power Electronics 30 (5), 2456-2464, 2014 | 341 | 2014 |
| Review on joint shear strength of nano-silver paste and its long-term high temperature reliability R Khazaka, L Mendizabal, D Henry Journal of electronic materials 43, 2459-2466, 2014 | 201 | 2014 |
| Evaluation of encapsulation materials for high-temperature power device packaging ML Locatelli, R Khazaka, S Diaham, CD Pham, M Bechara, S Dinculescu, ... IEEE transactions on power electronics 29 (5), 2281-2288, 2013 | 86 | 2013 |
| Polyimide lifetime under partial discharge aging: effects of temperature, pressure and humidity E Sili, JP Cambronne, N Naudé, R Khazaka IEEE Transactions on Dielectrics and Electrical Insulation 20 (2), 435-442, 2013 | 81 | 2013 |
| Broadband dielectric spectroscopy of BPDA/ODA polyimide films R Khazaka, ML Locatelli, S Diaham, P Bidan, L Dupuy, G Grosset Journal of Physics D: Applied Physics 46 (6), 065501, 2013 | 48 | 2013 |
| Effects of mechanical stresses, thickness and atmosphere on aging of polyimide thin films at high temperature R Khazaka, ML Locatelli, S Diaham, P Bidan Polymer degradation and stability 98 (1), 361-367, 2013 | 45 | 2013 |
| Dielectric strength of parylene HT S Diaham, M Bechara, ML Locatelli, R Khazaka, C Tenailleau, R Kumar Journal of Applied Physics 115 (5), 2014 | 31 | 2014 |
| BPDA-PDA polyimide: Synthesis, characterizations, aging and semiconductor device passivation S Diaham, ML Locatelli, R Khazaka High Performance Polymers-Polyimides Based-From Chemistry to Applications, 15-36, 2012 | 30 | 2012 |
| Characterization of nanosilver dry films for high-temperature applications R Khazaka, B Thollin, L Mendizabal, D Henry, R Hanna IEEE Transactions on Device and Materials Reliability 15 (2), 149-155, 2015 | 27 | 2015 |
| Endurance of thin insulation polyimide films for high-temperature power module applications R Khazaka, ML Locatelli, S Diaham, P Bidan IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 2013 | 17 | 2013 |
| Parameters affecting the DC breakdown strength of parylene F thin films R Khazaka, M Bechara, S Diaham, ML Locatelli 2011 Annual Report Conference on Electrical Insulation and Dielectric …, 2011 | 14 | 2011 |
| Assessment of dielectric encapsulation for high temperature high voltage modules R Khazaka, L Mendizabal, D Henry, R Hanna, O Lesaint 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1914-1919, 2015 | 13 | 2015 |
| Thermal and thermo-oxidative aging effects on the dielectric properties of thin polyimide films coated on metal substrate R Khazaka, S Diaham, ML Locatelli, C Trupin, B Schlegel 2011 Annual Report Conference on Electrical Insulation and Dielectric …, 2011 | 9 | 2011 |
| Overview and new trends in technology bricks for reliability enhancement in future wide band gap power converters for More Electrical Aircraft (MEA) and More Electrical … B Revol, S Azzopardi, T Youssef, JSN Teu, C Gautier, R Khazaka, ... IECON 2019-45th Annual Conference of the IEEE Industrial Electronics Society …, 2019 | 8 | 2019 |
| Design considerations of windings formed with hollow conductors cooled with phase change material S Ayat, B Dagusé, R Khazaka 2019 IEEE Energy Conversion Congress and Exposition (ECCE), 5652-5658, 2019 | 8 | 2019 |
| Assembly comprising hybrid interconnecting means including intermediate interconnecting elements and sintered metal joints, and manufacturing process R Khazaka, B Thollin US Patent 11,011,490, 2021 | 7 | 2021 |
| Thermal analysis of power module with double sided direct cooling using ceramic heat sinks N Botter, Y Avenas, JM Missiaen, D Bouvard, R Khazaka CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020 | 7 | 2020 |
| Conductivity spectroscopy and conduction current measurements of polyimide thin films during high temperature aging R Khazaka, ML Locatelli, S Diaham 2011-14th International Symposium on Electrets, 107-108, 2011 | 7 | 2011 |
| Thermal aging of power module assemblies based on ceramic heat sink and multilayers pressureless silver sintering N Botter, R Khazaka, Y Avenas, JM Missiaen, D Bouvard, S Azzopardi Microelectronics Reliability 126, 114206, 2021 | 6 | 2021 |
| Direct printing of heat sinks, cases and power connectors on insulated substrate using selective laser melting techniques R Khazaka, D Martineau, T Youssef, TL Le, S Azzopardi 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2173-2179, 2019 | 6 | 2019 |
