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Tamás Hurtony
Tamás Hurtony
在 ett.bme.hu 的电子邮件经过验证
标题
引用次数
引用次数
年份
Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders
O Krammer, T Garami, B Horváth, T Hurtony, B Medgyes, L Jakab
Journal of Alloys and Compounds 634, 156-162, 2015
412015
Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM
T Hurtony, A Bonyár, P Gordon, G Harsányi
Microelectronics Reliability 52 (6), 1138-1142, 2012
392012
Application of ZnO nanoparticles in Sn99Ag0. 3Cu0. 7-based composite solder alloys
A Skwarek, O Krammer, T Hurtony, P Ptak, K Górecki, S Wroński, ...
Nanomaterials 11 (6), 1545, 2021
382021
Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies
A Skwarek, P Ptak, K Górecki, T Hurtony, B Illés
Materials 13 (7), 1563, 2020
292020
Characterization of the microstructure of tin-silver lead free solder
T Hurtony, A Szakál, L Almásy, A Len, S Kugler, A Bonyár, P Gordon
Journal of Alloys and Compounds 672, 13-19, 2016
232016
Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys
B Illés, T Hurtony, B Medgyes
Corrosion Science 99, 313-319, 2015
232015
Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints
A Skwarek, B Illés, P Górecki, A Pietruszka, J Tarasiuk, T Hurtony
Journal of Materials Research and Technology 22, 403-412, 2023
202023
Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy
B Illés, H Choi, T Hurtony, K Dušek, D Bušek, A Skwarek
Journal of Materials Research and Technology 20, 4231-4240, 2022
172022
Whisker growth from vacuum evaporated submicron Sn thin films
B Illés, A Skwarek, R Bátorfi, J Ratajczak, A Czerwinski, O Krammer, ...
Surface and Coatings Technology 311, 216-222, 2017
152017
Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components
D Straubinger, T Hurtony, A Géczy
Journal of Materials Research and Technology 21, 308-318, 2022
142022
Effect of Cu substrate roughness and Sn layer thickness on whisker development from Sn thin-films
B Illés, T Hurtony, O Krammer, B Medgyes, K Dušek, D Bušek
Materials 12 (21), 3609, 2019
142019
Microstructure comparison of soldered joints using electrochemical selective etching
T Hurtony, A Bonyár, P Gordon
Materials Science Forum 729, 367-372, 2013
122013
Kinetics of Sn whisker growth from Sn thin-films on Cu substrate
B Illés, O Krammer, T Hurtony, K Dušek, D Bušek, A Skwarek
Journal of Materials Science: Materials in Electronics 31, 16314-16323, 2020
112020
Formation and distribution of Sn-Cu IMC in lead-free soldering process induced by laser heating
T Hurtony, B Balogh, P Gordon
Micro and Nanosystems 2 (3), 178-184, 2010
112010
Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers
B Illés, T Hurtony, B Medgyes, O Krammer, K Dusek, D Busek
Vacuum 187, 110121, 2021
82021
Mössbauer studies of β→ α phase transition in Sn-rich solder alloys
P Zachariasz, A Skwarek, B Illés, J Żukrowski, T Hurtony, K Witek
Microelectronics Reliability 82, 165-170, 2018
82018
Assessment of distribution of pellets in tablets by non-destructive microfocus X-ray imaging and image analysis technique
Z Csobán, B Kállai-Szabó, N Kállai-Szabó, T Takács, T Hurtony, P Gordon, ...
Powder Technology 301, 228-233, 2016
82016
Selective electrochemical etching for the investigation of solder joint microstructures
A Bonyár, T Hurtony, G Harsányi
2012 35th International Spring Seminar on Electronics Technology, 89-94, 2012
72012
Simulation and modeling of laser ablation
T Hurtony
2008 31st International Spring Seminar on Electronics Technology, 452-457, 2008
72008
Reliability studies of InnoLot and SnBi joints soldered on DBC substrate
A Skwarek, B Illés, K Witek, T Hurtony, J Tarasiuk, S Wronski, ...
Soldering & Surface Mount Technology 30 (4), 205-212, 2018
62018
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