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Dennis Rich
Dennis Rich
在 stanford.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
The thermodynamics of restoring underwater superhydrophobicity
PR Jones, AT Kirn, YD Ma, DT Rich, NA Patankar
Langmuir 33 (11), 2911-2919, 2017
142017
Foundry monolithic 3D BEOL transistor+ memory stack: Iso-performance and Iso-footprint BEOL carbon nanotube FET+ RRAM vs. FEOL silicon FET+ RRAM
T Srimani, AC Yu, RM Radway, DT Rich, M Nelson, S Wong, D Murphy, ...
2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2023
102023
Cooling future system-on-chips with diamond inter-tiers
M Malakoutian, A Kasperovich, D Rich, K Woo, C Perez, R Soman, ...
Cell Reports Physical Science 4 (12), 2023
72023
N3XT 3D Technology Foundations and Their Lab-to-Fab: Omni 3D Logic, Logic+ Memory Ultra-Dense 3D, 3D Thermal Scaffolding
T Srimani, A Bechdolt, S Choi, C Gilardi, A Kasperovich, S Li, Q Lin, ...
2023 International Electron Devices Meeting (IEDM), 1-4, 2023
62023
Heterogeneous 3D nano-systems: The N3XT approach?
D Rich, A Bartolo, C Gilardo, B Le, H Li, R Park, RM Radway, ...
NANO-CHIPS 2030: On-Chip AI for an Efficient Data-Driven World, 127-151, 2020
62020
Controlling phase change: Drying-up under water or staying wet during boiling
P Jones, A Kirn, D Rich, A Elliot, N Patankar
APS Division of Fluid Dynamics Meeting Abstracts, R35. 011, 2014
62014
EMBER: A 100 MHz, 0.86 mm2, Multiple-Bits-per-Cell RRAM Macro in 40 nm CMOS with Compact Peripherals and 1.0 pJ/bit Read Circuitry
LR Upton, A Levy, MD Scott, D Rich, WS Khwa, YD Chih, MF Chang, ...
ESSCIRC 2023-IEEE 49th European Solid State Circuits Conference (ESSCIRC …, 2023
42023
Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits
D Rich, A Kasperovich, M Malakoutian, RM Radway, S Hagiwara, ...
2023 60th ACM/IEEE Design Automation Conference (DAC), 1-6, 2023
32023
Ultra-Dense 3D Physical Design Unlocks New Architectural Design Points with Large Benefits
T Srimani, RM Radway, J Kim, K Prabhu, D Rich, C Gilardi, P Raina, ...
2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2023
32023
Lossless Phonon Transition Through GaN‐Diamond and Si‐Diamond Interfaces
M Malakoutian, K Woo, D Rich, R Mandia, X Zheng, A Kasperovich, ...
Advanced Electronic Materials, 2400146, 2024
22024
EMBER: Efficient Multiple-Bits-Per-Cell Embedded RRAM Macro for High-Density Digital Storage
A Levy, LR Upton, MD Scott, D Rich, WS Khwa, YD Chih, MF Chang, ...
IEEE Journal of Solid-State Circuits, 2024
22024
Testbench on a Chip: A Yield Test Vehicle for Resistive Memory Devices
LR Upton, G Lallement, MD Scott, J Taylor, RM Radway, D Rich, ...
2023 24th International Symposium on Quality Electronic Design (ISQED), 1-7, 2023
12023
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