| Single-phase liquid friction factors in microchannels ME Steinke, SG Kandlikar International journal of thermal sciences 45 (11), 1073-1083, 2006 | 582 | 2006 |
| An experimental investigation of flow boiling characteristics of water in parallel microchannels ME Steinke, SG Kandlikar J. Heat Transfer 126 (4), 518-526, 2004 | 392 | 2004 |
| Contact angles and interface behavior during rapid evaporation of liquid on a heated surface SG Kandlikar, ME Steinke International Journal of Heat and Mass Transfer 45 (18), 3771-3780, 2002 | 239 | 2002 |
| Single-phase heat transfer enhancement techniques in microchannel and minichannel flows ME Steinke, SG Kandlikar International Conference on Nanochannels, Microchannels, and Minichannels …, 2004 | 236 | 2004 |
| Apparatus and method for facilitating cooling of an electronics system MK Iyengar, V Kamath, JA Matteson, RR Schmidt, ME Steinke US Patent 7,660,109, 2010 | 190 | 2010 |
| Review of single-phase heat transfer enhancement techniques for application in microchannels, minichannels and microdevices ME Steinke, SG Kandlikar International Journal of Heat and Technology 22 (2), 3-11, 2004 | 156 | 2004 |
| High speed photographic observation of flow boiling of water in parallel minichannels SG Kandlikar, ME Steinke, S Tian, LA Campbell 35th Proceedings of National Heat Transfer Conference, 1-10, 2001 | 149 | 2001 |
| Control and effect of dissolved air in water during flow boiling in microchannels ME Steinke, SG Kandlikar International Journal of Heat and Mass Transfer 47 (8-9), 1925-1935, 2004 | 147 | 2004 |
| Predicting heat transfer during flow boiling in minichannels and microchannels/Discussion SG Kandlikar, ME Steinke ASHRAE Transactions 109, 667, 2003 | 134 | 2003 |
| Single-phase liquid heat transfer in plain and enhanced microchannels ME Steinke, SG Kandlikar International Conference on Nanochannels, Microchannels, and Minichannels …, 2006 | 132 | 2006 |
| Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchanger EA Eckberg, V Kamath, HV Mahaney Jr, WM Megarity, ME Steinke US Patent 8,789,384, 2014 | 85 | 2014 |
| Flow boiling and pressure drop in parallel flow microchannels ME Steinke, SG Kandlikar International Conference on Nanochannels, Microchannels, and Minichannels …, 2003 | 81 | 2003 |
| Contact angles of droplets during spread and recoil after impinging on a heated surface SG Kandlikar, ME Steinke Chemical Engineering Research and Design 79 (4), 491-498, 2001 | 67 | 2001 |
| Cooled electronic system with thermal spreaders coupling electronics cards to cold rails TJ Chainer, MA Gaynes, DP Graybill, MK Iyengar, V Kamath, ... US Patent 8,493,738, 2013 | 66 | 2013 |
| Liquid-cooled memory system having one cooling pipe per pair of DIMMs GI Meijer, DI Schmidt, ME Steinke, JS Womble US Patent 8,659,897, 2014 | 65 | 2014 |
| Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system TJ Chainer, DP Graybill, MK Iyengar, V Kamath, BJ Kochuparambil, ... US Patent 9,027,360, 2015 | 64 | 2015 |
| Thermal transfer structures coupling electronics card (s) to coolant-cooled structure (s) MP David, DP Graybill, MK Iyengar, V Kamath, BJ Kochuparambil, ... US Patent 8,913,384, 2014 | 58 | 2014 |
| Liquid-cooling memory modules with liquid flow pipes between memory module sockets RM Barina, V Kamath, C Ni, DI Schmidt, ME Steinke, JS Womble US Patent 8,587,943, 2013 | 53 | 2013 |
| Single-phase liquid heat transfer in microchannels ME Steinke, SG Kandlikar International Conference on Nanochannels, Microchannels, and Minichannels …, 2005 | 51 | 2005 |
| User-serviceable liquid DIMM cooling system RM Barina, V Kamath, C Ni, DI Schmidt, ME Steinke, JS Womble US Patent 8,638,559, 2014 | 50 | 2014 |
Kandlikar SGMechanical Engineering, Rochester Institute of Technology在 rit.edu 的电子邮件经过验证
Kandlikar SGMechanical Engineering, Rochester Institute of Technology在 rit.edu 的电子邮件经过验证