| Reduction of threading dislocation density in Ge/Si using a heavily As-doped Ge seed layer KH Lee, S Bao, B Wang, C Wang, SF Yoon, J Michel, EA Fitzgerald, ... AIP Advances 6 (2), 2016 | 64 | 2016 |
| Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young’s modulus P Verdonck, C Wang, QT Le, L Souriau, K Vanstreels, M Krishtab, ... Microelectronic engineering 120, 225-229, 2014 | 25 | 2014 |
| On-chip optical interconnects using ingan light-emitting diodes integrated with si-cmos B Wang, L Zhang, W Zhang, C Wang, KEK Lee, J Michel, SJ Chua, ... Asia Communications and Photonics Conference, AW4A. 2, 2014 | 17 | 2014 |
| Epitaxy and characterization of GaInP/AlInP light-emitting diodes on As-doped Ge/Si substrates C Wang, B Wang, KH Lee, CS Tan, SF Yoon, J Michel Optics express 24 (20), 23129-23135, 2016 | 9 | 2016 |
| Germanium-on-insulator virtual substrate for InGaP epitaxy S Bao, KH Lee, C Wang, B Wang, RI Made, SF Yoon, J Michel, ... Materials Science in Semiconductor Processing 70, 17-23, 2017 | 8 | 2017 |
| Direct bandgap photoluminescence from n-type indirect GaInP alloys C Wang, B Wang, RI Made, SF Yoon, J Michel Photonics Research 5 (3), 239-244, 2017 | 8 | 2017 |
| Automatic place-and-route of emerging LED-driven wires within a monolithically-integrated CMOS− III-V process T Krishna, A Balachandran, SB Chiah, L Zhang, B Wang, C Wang, ... Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017 …, 2017 | 8 | 2017 |
| Novel integrated circuit platforms employing monolithic silicon CMOS+ GaN devices EA Fitzgerald, KE Lee, L Zhang, CC Huang, A Kadir, S Bao, Z Ren, ... ECS Transactions 75 (12), 31, 2016 | 7 | 2016 |
| Direct MOCVD epitaxy of GaAsP on SiGe virtual substrate without growth of SiGe B Wang, C Wang, DA Kohen, RI Made, KEK Lee, T Kim, T Milakovich, ... Journal of Crystal Growth 441, 78-83, 2016 | 6 | 2016 |
| Red InGaP light-emitting diodes epitaxially grown on engineered Ge-on-Si substrates B Wang, C Wang, KH Lee, S Bao, KEK Lee, CS Tan, SF Yoon, ... Light-Emitting Diodes: Materials, Devices, and Applications for Solid State …, 2016 | 6 | 2016 |
| Control wafer bow of InGaP on 200 mm Si by strain engineering B Wang, S Bao, RI Made, KH Lee, C Wang, KEK Lee, EA Fitzgerald, ... Semiconductor Science and Technology 32 (12), 125013, 2017 | 5 | 2017 |
| Study of porogen removal by atomic hydrogen generated by hot wire chemical vapor deposition for the fabrication of advanced low-k thin films S Godavarthi, C Wang, P Verdonck, Y Matsumoto, I Koudriavtsev, A Dutt, ... Thin Solid Films 575, 103-106, 2015 | 3 | 2015 |
| 3D NAND Oxide/Nitride Tier Stack Thickness Measurements with Infrared Metrology Y Wang, Z Chen, C Wang, N Keller, GA Antonelli, Z Liu, T Ribaudo, ... 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC …, 2023 | 2 | 2023 |
| Measurement of W-recess profile in advanced node 3D NAND device with IRCD technology utilizing a specialized design-rule compliant target N Keller, Z Chen, P Wang, R Grynko, T Ribaudo, GA Antonelli, Y Wang, ... Metrology, Inspection, and Process Control XXXVII 12496, 530-542, 2023 | | 2023 |
| Development and evaluation of a-SiC: H films using a dimethylsilacyclopentane precursor as a low-k Cu capping layer E Van Besien, C Wang, P Verdonck, A Singh, Y Barbarin, JF de Marneffe, ... 2013 IEEE International Interconnect Technology Conference-IITC, 1-3, 2013 | | 2013 |
| Evaluation of barrier integrity on ultra low-k films with different porosities C Wang, E Van Besien, M Baklanov, P Verdonck | | 2013 |
| Study of porogen removal by HWCVD for the fabrication of advanced low-k films S Godavarthi, C Wang, P Verdonck, Y Matsumoto, I Koudriavtsev, ... | | 2012 |
