| Infrared brazing of TiAl intermetallic using BAg-8 braze alloy RK Shiue, SK Wu, SY Chen Acta Materialia 51 (7), 1991-2004, 2003 | 217 | 2003 |
| The interfacial reactions of infrared brazing Cu and Ti with two silver-based braze alloys RK Shiue, SK Wu, CH Chan Journal of Alloys and Compounds 372 (1-2), 148-157, 2004 | 130 | 2004 |
| The microstructural observation and wettability study of brazing Ti-6Al-4V and 304 stainless steel using three braze alloys CC Liu, CL Ou, RK Shiue Journal of materials science 37, 2225-2235, 2002 | 125 | 2002 |
| The study of carbon migration in dissimilar welding of the modified 9Cr-1Mo steel YY You, RK Shiue, RH Shiue, C Chen Journal of materials science letters 20 (15), 1429-1432, 2001 | 97 | 2001 |
| Infrared brazing of Ti50Al50 and Ti–6Al–4V using two Ti-based filler metals RK Shiue, SK Wu, YT Chen, CY Shiue Intermetallics 16 (9), 1083-1089, 2008 | 88 | 2008 |
| Laser transformation hardening of tempered 4340 steel RK Shiue, C Chen Metallurgical Transactions A 23, 163-170, 1992 | 88 | 1992 |
| Infrared brazing of TiAl using Al-based braze alloys RK Shiue, SK Wu, SY Chen Intermetallics 11 (7), 661-671, 2003 | 86 | 2003 |
| Infrared brazing of high-strength titanium alloys by Ti–15Cu–15Ni and Ti–15Cu–25Ni filler foils CT Chang, YC Du, RK Shiue, CS Chang Materials Science and Engineering: A 420 (1-2), 155-164, 2006 | 81 | 2006 |
| Infrared brazing of TiAl intermetallic using pure silver RK Shiue, SK Wu, SY Chen Intermetallics 12 (7-9), 929-936, 2004 | 78 | 2004 |
| Toughness and austenite stability of modified 9Cr–1Mo welds after tempering RK Shiue, KC Lan, C Chen Materials Science and Engineering: A 287 (1), 10-16, 2000 | 67 | 2000 |
| Brazing of 422 stainless steel using the AWS classification BNi-2 Braze alloy CL Ou, DW Liaw, YC Du, RK Shiue Journal of materials science 41, 6353-6361, 2006 | 65 | 2006 |
| Infrared brazing of Ti-6Al-4V and 17-4 PH stainless steel with a nickel barrier layer RK Shiue, SK Wu, CH Chan, CS Huang Metallurgical and Materials Transactions A 37, 2207-2217, 2006 | 64 | 2006 |
| The reliability study of selected Sn–Zn based lead-free solders on Au/Ni–P/Cu substrate RK Shiue, LW Tsay, CL Lin, JL Ou Microelectronics reliability 43 (3), 453-463, 2003 | 64 | 2003 |
| A wettability study of Cu/Sn/Ti active braze alloys on alumina CC Lin, RB Chen, RK Shiue Journal of materials science 36, 2145-2150, 2001 | 64 | 2001 |
| Abrasive tool containing coated superabrasive grain RK Shiue, ST Buljan, BJ Miller, E Schulz, TW Eagar US Patent 5,855,314, 1999 | 63 | 1999 |
| Effect of solder creep on the reliability of large area die attachment WD Zhuang, PC Chang, FY Chou, RK Shiue Microelectronics Reliability 41 (12), 2011-2021, 2001 | 62 | 2001 |
| Microstructural evolution at the bonding interface during the early-stage infrared active brazing of alumina RK Shiue, SK Wu, JM O, JY Wang Metallurgical and Materials Transactions A 31, 2527-2536, 2000 | 59 | 2000 |
| Strong bonding of infrared brazed α2-Ti3Al and Ti–6Al–4V using Ti–Cu–Ni fillers RK Shiue, SK Wu, YT Chen Intermetallics 18 (1), 107-114, 2010 | 58 | 2010 |
| Infrared brazing Ti–6Al–4V and SP-700 alloys using the Ti–20Zr–20Cu–20Ni braze alloy CT Chang, ZY Wu, RK Shiue, CS Chang Materials letters 61 (3), 842-845, 2007 | 57 | 2007 |
| A study of Sn-Bi-Ag-(In) lead-free solders RK Shiue, LW Tsay, CL Lin, JL Ou Journal of materials science 38, 1269-1279, 2003 | 57 | 2003 |
