| An automated detection of heart arrhythmias using machine learning technique: SVM CU Kumari, ASD Murthy, BL Prasanna, MPP Reddy, AK Panigrahy Materials Today: Proceedings 45, 1393-1398, 2021 | 200 | 2021 |
| Low temperature Cu–Cu bonding technology in three-dimensional integration: An extensive review AK Panigrahy, KN Chen Journal of Electronic packaging 140 (1), 010801, 2018 | 93 | 2018 |
| A multi-walled carbon nanotube–zinc oxide nanofiber based flexible chemiresistive biosensor for malaria biomarker detection AK Panigrahi, V Singh, SG Singh Analyst 142 (12), 2128-2135, 2017 | 61 | 2017 |
| Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure AK Panigrahi, S Bonam, T Ghosh, SG Singh, SRK Vanjari Materials Letters 169, 269-272, 2016 | 58 | 2016 |
| Interface and reliability analysis of Au-passivated Cu–Cu fine-pitch thermocompression bonding for 3-D IC applications S Bonam, AK Panigrahi, CH Kumar, SRK Vanjari, SG Singh IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (7 …, 2019 | 48 | 2019 |
| Demonstration of sub 150° C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer AK Panigrahi, T Ghosh, SRK Vanjari, SG Singh Materials Letters 194, 86-89, 2017 | 48 | 2017 |
| Oxidation resistive, CMOS compatible copper-based alloy ultrathin films as a superior passivation mechanism for achieving 150 C Cu–Cu wafer on wafer thermocompression bonding AK Panigrahi, T Ghosh, SRK Vanjari, SG Singh IEEE Transactions on Electron Devices 64 (3), 1239-1245, 2017 | 43 | 2017 |
| Hand gesture recognition and voice controlled robot M Meghana, CU Kumari, JS Priya, P Mrinal, KAV Sai, SP Reddy, ... Materials Today: Proceedings 33, 4121-4123, 2020 | 30 | 2020 |
| A novel teeth junction less gate all around FET for improving electrical characteristics C Meriga, RT Ponnuri, BVV Satyanarayana, AAK Gudivada, ... Silicon, 1-6, 2022 | 29 | 2022 |
| Low temperature, low pressure CMOS compatible Cu-Cu thermo-compression bonding with Ti passivation for 3D IC integration AK Panigrahi, S Bonam, T Ghosh, SRK Vanjari, SG Singh 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2205-2210, 2015 | 28 | 2015 |
| A study of an ultrasensitive label free silicon nanowire FET biosensor for cardiac troponin I detection MD Prakash, BV Krsihna, BVV Satyanarayana, NA Vignesh, ... Silicon 14 (10), 5683-5690, 2022 | 26 | 2022 |
| Performance analysis of ion-sensitive field effect transistor with various oxide materials for biomedical applications MD Prakash, BG Nelam, S Ahmadsaidulu, A Navaneetha, AK Panigrahy Silicon, 1-11, 2021 | 26 | 2021 |
| Feature extraction and detection of obstructive sleep apnea from raw eeg signal C Usha Kumari, P Kora, K Meenakshi, K Swaraja, T Padma, ... International Conference on Innovative Computing and Communications …, 2020 | 25 | 2020 |
| Facile non thermal plasma based desorption of self assembled monolayers for achieving low temperature and low pressure Cu–Cu thermo-compression bonding T Ghosh, K Krushnamurthy, AK Panigrahi, A Dutta, C Subrahmanyam, ... RSC advances 5 (125), 103643-103648, 2015 | 25 | 2015 |
| Surface density gradient engineering precedes enhanced diffusion; drives CMOS in-line process flow compatible Cu–Cu thermocompression bonding at 75 C AK Panigrahy, T Ghosh, SRK Vanjari, SG Singh IEEE Transactions on Device and Materials Reliability 19 (4), 791-795, 2019 | 22 | 2019 |
| Design and modelling of highly sensitive glucose biosensor for lab-on-chip applications MD Prakash, SL Nihal, S Ahmadsaidulu, R Swain, AK Panigrahy Silicon 14 (14), 8621-8627, 2022 | 21 | 2022 |
| Direct, CMOS in-line process flow compatible, sub 100 C Cu–Cu thermocompression bonding using stress engineering AK Panigrahi, T Ghosh, CH Kumar, SG Singh, SRK Vanjari Electronic Materials Letters 14, 328-335, 2018 | 21 | 2018 |
| An extensive survey on finger and palm vein recognition system RV Adiraju, KK Masanipalli, TD Reddy, R Pedapalli, S Chundru, ... Materials Today: Proceedings 45, 1804-1808, 2021 | 20 | 2021 |
| A highly sensitive graphene-based field effect transistor for the detection of myoglobin BV Krsihna, A Gangadhar, S Ravi, D Mohan, AK Panigrahy, VR Rajeswari, ... Silicon 14 (17), 11741-11748, 2022 | 19 | 2022 |
| Fungal disease in cotton leaf detection and classification using neural networks and support vector machine CU Kumari, NA Vignesh, AK Panigrahy, L Ramya, T Padma Entropy 1 (2.3965831), 3-0200073, 2019 | 18 | 2019 |
Shiv Govind SinghProfessor, Electrical Engineering, IITHyderabad在 ee.iith.ac.in 的电子邮件经过验证
