| Improved reliability of power modules: A review of online junction temperature measurement methods N Baker, M Liserre, L Dupont, Y Avenas IEEE Industrial Electronics Magazine 8 (3), 17-27, 2014 | 257 | 2014 |
| IGBT junction temperature measurement via peak gate current N Baker, S Munk-Nielsen, F Iannuzzo, M Liserre IEEE Transactions on Power Electronics 31 (5), 3784-3793, 2015 | 170 | 2015 |
| Condition monitoring: A decade of proposed techniques Y Avenas, L Dupont, N Baker, H Zara, F Barruel IEEE Industrial Electronics Magazine 9 (4), 22-36, 2015 | 128 | 2015 |
| IR camera validation of IGBT junction temperature measurement via peak gate current N Baker, L Dupont, S Munk-Nielsen, F Iannuzzo, M Liserre IEEE Transactions on Power Electronics 32 (4), 3099-3111, 2016 | 113 | 2016 |
| Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters N Baker, M Liserre, L Dupont, Y Avenas IECON 2013-39th Annual Conference of the IEEE Industrial Electronics Society …, 2013 | 74 | 2013 |
| Wear-Out Condition Monitoring of IGBT and mosfet Power Modules in Inverter Operation F Gonzalez-Hernando, J San-Sebastian, A Garcia-Bediaga, M Arias, ... IEEE Transactions on Industry Applications 55 (6), 6184-6192, 2019 | 65 | 2019 |
| Online junction temperature measurement via internal gate resistance during turn-on N Baker, S Munk-Nielsen, M Liserre, F Iannuzzo 2014 16th European conference on power electronics and applications, 1-10, 2014 | 61 | 2014 |
| Study of current density influence on bond wire degradation rate in SiC MOSFET modules H Luo, F Iannuzzo, N Baker, F Blaabjerg, W Li, X He IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (2 …, 2019 | 58 | 2019 |
| Online junction temperature measurement using peak gate current N Baker, S Munk-Nielsen, F Iannuzzo, M Liserre 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 1270-1275, 2015 | 46 | 2015 |
| Simultaneous on-state voltage and bond-wire resistance monitoring of silicon carbide MOSFETs N Baker, H Luo, F Iannuzzo Energies 10 (3), 384, 2017 | 43 | 2017 |
| Die degradation effect on aging rate in accelerated cycling tests of SiC power MOSFET modules H Luo, N Baker, F Iannuzzo, F Blaabjerg Microelectronics Reliability 76, 415-419, 2017 | 37 | 2017 |
| Test setup for long term reliability investigation of Silicon Carbide MOSFETs N Baker, S Munk-Nielsen, S Bęczkowski 2013 15th European Conference on Power Electronics and Applications (EPE), 1-9, 2013 | 37 | 2013 |
| Vce-based chip temperature estimation methods for high power IGBT modules during power cycling—A comparison A Amoiridis, A Anurag, P Ghimire, S Munk-Nielsen, N Baker 2015 17th European Conference on Power Electronics and Applications (EPE'15 …, 2015 | 34 | 2015 |
| The temperature dependence of the flatband voltage in high-power IGBTs N Baker, F Iannuzzo IEEE Transactions on Industrial Electronics 66 (7), 5581-5584, 2018 | 32 | 2018 |
| Impact of Kelvin-source resistors on current sharing and failure detection in multichip power modules N Baker, F Iannuzzo, H Li 2018 20th European Conference on Power Electronics and Applications (EPE'18 …, 2018 | 20 | 2018 |
| Experimental evaluation of IGBT junction temperature measurement via peak gate current N Baker, S Munk-Nielsen, F Iannuzzo, L Dupont, M Liserre 2015 17th European Conference on Power Electronics and Applications (EPE'15 …, 2015 | 18 | 2015 |
| An electrical method for junction temperature measurement of power semiconductor switches N Baker | 14 | 2016 |
| Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis H Du, S Letz, N Baker, T Goetz, F Iannuzzo, A Schletz Microelectronics Reliability 114, 113784, 2020 | 13 | 2020 |
| Smart SiC MOSFET accelerated lifetime testing N Baker, F Iannuzzo Microelectronics Reliability 88, 43-47, 2018 | 13 | 2018 |
| Experimental evaluation of IGBT junction temperature measurement via a Modified-VCE (ΔVCE_ΔVGE) method with series resistance removal N Baker, F Iannuzzo, S Munk-Nielsen, L Dupont, Y Avenas CIPS 2016; 9th International Conference on Integrated Power Electronics …, 2016 | 11 | 2016 |
