| Metasurfaces for filter miniaturization and out-of-band rejection improvement A Arsanjani, C Bartlett, L Robins, R Teschl, W Bösch, M Höft IEEE Microwave and Wireless Technology Letters 33 (3), 271-274, 2023 | 7 | 2023 |
| 3D-printed dielectric resonators for quasi-TE112 mode singlets, doublets and dual-mode filters L Robins, C Bartlett, A Arsanjani, A Widaa, R Teschl, M Höft, W Bösch IEEE Access 10, 130326-130338, 2022 | 6 | 2022 |
| Implementation of K-band Mushroom meta-material filter for satellite applications A Arsanjani, L Robins, R Teschl, W Bösch 2020 50th European Microwave Conference (EuMC), 495-498, 2021 | 5 | 2021 |
| Additive manufacturing of non-homogenous dielectric waveguide structures and filters L Robins, A Arsanjani, C Bartlett, R Teschl, W Bösch, MM Höft 2021 IEEE MTT-S International Microwave Filter Workshop: IMFW 2021, 326-328, 2021 | 4 | 2021 |
| Additive manufacturing of a 4th-order K-band semi-planar slow-wave filter A Arsanjani, L Robins, B Meier, J Petrusa, R Teschl, W Bösch 2021 IEEE MTT-S International Microwave Filter Workshop (IMFW), 332-334, 2021 | 3 | 2021 |
| A 3-D-Printed Dielectric Resonators for Triple-Mode Applications L Robins, C Bartlett, A Arsanjani, R Teschl, W Bösch, M Höft IEEE Microwave and Wireless Technology Letters, 2023 | 2 | 2023 |
| Development of a sealed 3D printed dielectric filled waveguide filter with embedded lattices L Robins, A Arsanjani, H Takahashi, R Teschl, W Bösch 2022 Asia-Pacific Microwave Conference (APMC), 115-117, 2022 | 1 | 2022 |
| MARCH 2023 VOLUME 33 NUMBER 3 IMWCBJ (ISSN 2771-957X) LJ Wang, R Su, J Lv, G Xu, T Liu, ZC Zhang, F Hou, DW Wang, J Liu, ... | | |
