| The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ... IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004 | 186 | 2004 |
| A review of 5G front-end systems package integration AO Watanabe, M Ali, SYB Sayeed, RR Tummala, MR Pulugurtha IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 172 | 2020 |
| Colloidal processing of polymer ceramic nanocomposite integral capacitors H Windlass, PM Raj, D Balaraman, SK Bhattacharya, RR Tummala IEEE transactions on electronics packaging manufacturing 26 (2), 100-105, 2003 | 125 | 2003 |
| Anisotropic shrinkage in tape‐cast alumina: Role of processing parameters and particle shape PM Raj, WR Cannon Journal of the American Ceramic Society 82 (10), 2619-2625, 1999 | 103 | 1999 |
| Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications H Windlass, PM Raj, D Balaraman, SK Bhattacharya, RR Tummala IEEE transactions on advanced packaging 26 (1), 10-16, 2003 | 79 | 2003 |
| Anisotropic shrinkage during sintering of particle-oriented systems—numerical simulation and experimental studies PM Raj, A Odulena, WR Cannon Acta materialia 50 (10), 2559-2570, 2002 | 79 | 2002 |
| Trend from ICs to 3D ICs to 3D systems RR Tummala, V Sundaram, R Chatterjee, PM Raj, N Kumbhat, ... 2009 IEEE Custom Integrated Circuits Conference, 439-444, 2009 | 69 | 2009 |
| First demonstration of compact, ultra-thin low-pass and bandpass filters for 5G small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ... IEEE Microwave and Wireless Components Letters 28 (12), 1110-1112, 2018 | 67 | 2018 |
| Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias AO Watanabe, TH Lin, M Ali, Y Wang, V Smet, PM Raj, MM Tentzeris, ... IEEE Transactions on Microwave Theory and Techniques 68 (12), 5082-5092, 2020 | 52 | 2020 |
| Antenna miniaturization using magneto-dielectric substrates N Altunyurt, M Swaminathan, PM Raj, V Nair 2009 59th Electronic Components and Technology Conference, 801-808, 2009 | 52 | 2009 |
| Broadband and miniaturized antenna-in-package (AiP) design for 5G applications TH Lin, K Kanno, AO Watanabe, PM Raj, RR Tummala, M Swaminathan, ... IEEE Antennas and Wireless Propagation Letters 19 (11), 1963-1967, 2020 | 44 | 2020 |
| Copper interconnections for high performance and fine pitch flip chip digital applications and ultra-miniaturized RF module applications RR Tummala, PM Raj, A Aggarwal, G Mehrotra, SW Koh, S Bansal, ... 56th Electronic Components and Technology Conference 2006, 10 pp., 2006 | 43 | 2006 |
| First demonstration of 28 GHz and 39 GHz transmission lines and antennas on glass substrates for 5G modules AO Watanabe, M Ali, B Tehrani, J Hester, H Matsuura, T Ogawa, PM Raj, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 236-241, 2017 | 41 | 2017 |
| Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF N Kumbhat, A Choudhury, M Raine, G Mehrotra, PM Raj, R Zhang, ... 2009 59th Electronic Components and Technology Conference, 1479-1485, 2009 | 39 | 2009 |
| Mid frequency decoupling using embedded decoupling capacitors P Muthana, M Swaminathan, E Engin, PM Raj, R Tummala IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging …, 2005 | 37 | 2005 |
| Magnetic nanocomposites for organic compatible miniaturized antennas and inductors PM Raj, P Muthana, TD Xiao, L Wan, D Balaraman, IR Abothu, ... Proceedings. International Symposium on Advanced Packaging Materials …, 2005 | 35 | 2005 |
| Glass-based IC-embedded antenna-integrated packages for 28-GHz high-speed data communications AO Watanabe, M Ali, R Zhang, S Ravichandran, T Kakutani, PM Raj, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 89-94, 2020 | 34 | 2020 |
| Miniaturized high-performance filters for 5G small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1068-1075, 2018 | 34 | 2018 |
| Magnetic and dielectric property studies in Fe-and NiFe-based polymer nanocomposites H Sharma, S Jain, PM Raj, KP Murali, R Tummala Journal of Electronic Materials 44, 3819-3826, 2015 | 31 | 2015 |
| Fundamental limits of organic packages and boards and the need for novel ceramic boards for next generation electronic packaging RR Tummala, PM Raj, S Atmur, S Bansal, S Banerji, F Liu, S Bhattacharya, ... Journal of electroceramics 13, 417-422, 2004 | 31 | 2004 |
