| All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration M Sivan, Y Li, H Veluri, Y Zhao, B Tang, X Wang, E Zamburg, JF Leong, ... Nature communications 10 (1), 5201, 2019 | 168 | 2019 |
| Wafer-scale solution-processed 2D material analog resistive memory array for memory-based computing B Tang, H Veluri, Y Li, ZG Yu, M Waqar, JF Leong, M Sivan, E Zamburg, ... Nature Communications 13 (1), 3037, 2022 | 140 | 2022 |
| Stress-memorized HZO for high-performance ferroelectric field-effect memtransistor SH Tsai, Z Fang, X Wang, U Chand, CK Chen, S Hooda, M Sivan, J Pan, ... ACS Applied Electronic Materials 4 (4), 1642-1650, 2022 | 31 | 2022 |
| Aerosol Jet Printed WSe2 Crossbar Architecture Device on Kapton With Dual Functionality as Resistive Memory and Photosensor for Flexible System Integration Y Li, X Feng, M Sivan, JF Leong, B Tang, X Wang, JN Tey, J Wei, KW Ang, ... IEEE Sensors Journal 20 (9), 4653-4659, 2020 | 28 | 2020 |
| 2-kbit Array of 3-D Monolithically-stacked IGZO FETs with Low SS-64mV/dec, Ultra-low-leakage, Competitive μ-57 cm2/V-s Performance and Novel nMOS-Only … U Chand, Z Fang, C Chun-Kuei, Y Luo, H Veluri, M Sivan, LJ Feng, ... 2021 Symposium on VLSI Technology, 1-2, 2021 | 21 | 2021 |
| A flexible InGaAs nanomembrane PhotoFET with tunable responsivities in near-and short-wave IR region for lightweight imaging applications Y Li, A Alian, M Sivan, L Huang, KW Ang, D Lin, D Mocuta, N Collaert, ... APL materials 7 (3), 2019 | 19 | 2019 |
| Physical insights into vacancy-based memtransistors: toward power efficiency, reliable operation, and scalability M Sivan, JF Leong, J Ghosh, B Tang, J Pan, E Zamburg, AVY Thean ACS nano 16 (9), 14308-14322, 2022 | 15 | 2022 |
| Low-thermal-budget BEOL-compatible beyond-silicon transistor technologies for future monolithic-3D compute and memory applications A Thean, SH Tsai, CK Chen, M Sivan, B Tang, S Hooda, Z Fang, J Pan, ... 2022 International Electron Devices Meeting (IEDM), 12.2. 1-12.2. 4, 2022 | 9 | 2022 |
| Aerosol Jet Printed WSe2 Based RRAM on Kapton Suitable for Flexible Monolithic Memory Integration Y Li, M Sivan, JX Niu, H Veluri, E Zamburg, J Leong, U Chand, S Samanta, ... 2019 IEEE International Conference on Flexible and Printable Sensors and …, 2019 | 9 | 2019 |
| N‐P Reconfigurable Dual‐Mode Memtransistors for Compact Bio‐Inspired Feature Extractor with Inhibitory‐Excitatory Spiking Capability JF Leong, Z Fang, M Sivan, J Pan, B Tang, E Zamburg, AVY Thean Advanced Functional Materials 33 (45), 2302949, 2023 | 8 | 2023 |
| Highly scaled strained silicon-on-insulator technology for the 5G era: Impact of geometry and annealing on strain retention and device performance of nMOSFETs EYJ Kong, S Yadav, D Lei, Y Kang, M Sivan, Y Li, BY Nguyen, ... IEEE Transactions on Electron Devices 66 (5), 2068-2074, 2019 | 4 | 2019 |
| Quantile Online Learning for Semiconductor Failure Analysis B Zhou, P Jieming, M Sivan, AVY Thean, J Senthilnath ICASSP 2023-2023 IEEE International Conference on Acoustics, Speech and …, 2023 | 1 | 2023 |
| Solution-processable 2D materials for monolithic 3D memory-sensing-computing platforms: opportunities and challenges B Tang, M Sivan, JF Leong, Z Xu, Y Zhang, J Li, R Wan, Q Wan, ... npj 2D Materials and Applications 8 (1), 74, 2024 | | 2024 |
| Design of Artificial Spiking Neuron with SiO2 Memristive Synapse to Demonstrate Neuron-Level Spike Timing Dependent Plasticity JX Niu, H Veluri, Y Li, U Chand, JF Leong, E Zamburg, M Sivan, ... 2019 International Conference on IC Design and Technology (ICICDT), 1-3, 2019 | | 2019 |
| Hole-Injection at WO3/WSe2 Interface Using a Plasma Oxidation Process for Hole Mobility Enhancement and SBH reduction in p-type 2-D WSe2 Nanosheet FET M Sivan, Y Li, Y Zhao, AVY Thean IEEE Semiconductor Interface Specialists Conference (SISC), 2018, 2018 | | 2018 |
Aaron TheanNational University of Singapore在 nus.edu.sg 的电子邮件经过验证
