Development of a ReaxFF Reactive Force Field for NaSiOx/Water Systems and Its Application to Sodium and Proton Self-Diffusion SH Hahn, J Rimsza, L Criscenti, W Sun, L Deng, J Du, T Liang, SB Sinnott, ... The Journal of Physical Chemistry C 122 (34), 19613-19624, 2018 | 87 | 2018 |
Surface reactivity and leaching of a sodium silicate glass under an aqueous environment: a ReaxFF molecular dynamics study SH Hahn, ACT Van Duin The Journal of Physical Chemistry C 123 (25), 15606-15617, 2019 | 74 | 2019 |
Searching for correlations between vibrational spectral features and structural parameters of silicate glass network H Liu, SH Hahn, M Ren, M Thiruvillamalai, TM Gross, J Du, ACT van Duin, ... Journal of the American Ceramic Society 103 (6), 3575-3589, 2020 | 58 | 2020 |
Friction-induced subsurface densification of glass at contact stress far below indentation damage threshold H He, SH Hahn, J Yu, Q Qiao, ACT van Duin, SH Kim Acta Materialia 189, 166-173, 2020 | 48 | 2020 |
Mechanical size effects of amorphous polymer-derived ceramics at the nanoscale: experiments and ReaxFF simulations A Vashisth, S Khatri, SH Hahn, W Zhang, ACT Van Duin, M Naraghi Nanoscale 11 (15), 7447-7456, 2019 | 47 | 2019 |
Subsurface structural change of silica upon nanoscale physical contact: Chemical plasticity beyond topographic elasticity H He, Z Chen, YT Lin, SH Hahn, J Yu, ACT van Duin, TD Gokus, ... Acta Materialia 208, 116694, 2021 | 39 | 2021 |
Structural features of sodium silicate glasses from reactive force field‐based molecular dynamics simulations L Deng, S Urata, Y Takimoto, T Miyajima, SH Hahn, ACT van Duin, J Du Journal of the American Ceramic Society 103 (3), 1600-1614, 2020 | 31 | 2020 |
Atomistic understanding of surface wear process of sodium silicate glass in dry versus humid environments SH Hahn, H Liu, SH Kim, ACT van Duin Journal of the American Ceramic Society 103 (5), 3060-3069, 2020 | 27 | 2020 |
Influence of acid leaching surface treatment on indentation cracking of soda lime silicate glass N Sheth, SH Hahn, D Ngo, A Howzen, R Bermejo, ACT van Duin, ... Journal of non-crystalline solids 543, 120144, 2020 | 25 | 2020 |
Investigation into the atomistic scale mechanisms responsible for the enhanced dielectric response in the interfacial region of polymer nanocomposites CU Gonzalez-Valle, SH Hahn, MG Muraleedharan, QM Zhang, ... The Journal of Physical Chemistry C 124 (21), 11558-11563, 2020 | 14 | 2020 |
Interfacial reactivity and speciation emerging from na-montmorillonite interactions with water and formic acid at 200 c: Insights from reactive molecular dynamics simulations … MG Muraleedharan, H Asgar, SH Hahn, N Dasgupta, G Gadikota, ... ACS Earth and Space Chemistry 5 (5), 1006-1019, 2021 | 13 | 2021 |
Factors governing wear of soda lime silicate glass: Insights from comparison between nano-and macro-scale wear H He, SH Hahn, J Yu, L Qian, SH Kim Tribology International 171, 107566, 2022 | 11 | 2022 |
Topological control of water reactivity on glass surfaces: evidence of a chemically stable intermediate phase CJ Wilkinson, K Doss, SH Hahn, N Keilbart, AR Potter, NJ Smith, I Dabo, ... The journal of physical chemistry letters 10 (14), 3955-3960, 2019 | 11 | 2019 |
Contamination-free Cu/SiCN hybrid bonding process development for sub-μm pitch devices with enhanced bonding characteristics SH Hahn, W Kim, D Shin, Y Lee, S Kim, W Choi, K Lim, B Moon, M Rhee 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1390-1396, 2023 | 9 | 2023 |
Novel characterization method of chip level hybrid bonding strength J Kim, K Lim, SH Hahn, M Lee, DMW Rhee 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1754-1760, 2021 | 8 | 2021 |
Revealing the structure of the sodium-leached layer of soda lime silica glass: A comprehensive spectroscopic analysis AL Ogrinc, Y Zhou, SH Hahn, YT Lin, SH Kim Journal of Non-Crystalline Solids 600, 121989, 2023 | 6 | 2023 |
Condensation and growth of amorphous aluminosilicate nanoparticles via an aggregation process R Dupuis, SH Hahn, ACT van Duin, RJM Pellenq, A Poulesquen Physical Chemistry Chemical Physics 24 (16), 9229-9235, 2022 | 6 | 2022 |
Non conductive film analysis using cure kinetics and rheokinetics for gang bonding process for 3DIC TSV packaging JY Moon, Y Shin, S Kim, SH Hahn, K Lim, JW Jung, C Lim, Y Kim, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 706-710, 2021 | 6 | 2021 |
Molecular Dynamics Study on Plasma-Surface Interactions of SiCN Dielectrics for Wafer-to-Wafer Hybrid Bonding Process SH Hahn, W Kim, D Shin, Y Lee, W Choi, B Moon, K Lim, M Rhee 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 527-533, 2022 | 5 | 2022 |
Deep neural network-based reduced-order modeling of ion–surface interactions combined with molecular dynamics simulation B Kim, J Bae, H Jeong, SH Hahn, S Yoo, SK Nam Journal of Physics D: Applied Physics 56 (38), 384005, 2023 | 4 | 2023 |