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Kaiying(Katherine) Jiang
Kaiying(Katherine) Jiang
Stanford University, University of Illinois at Urbana-Champaign
在 stanford.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
Web-Based Open-Source Tool for Isotachophoresis
AS Avaro, Y Sun, K Jiang, SS Bahga, JG Santiago
Analytical Chemistry 93 (47), 15768-15774, 2021
132021
Hydrodynamic Elastocapillary Morphing of Hair Bundles
J Ha, YS Kim, K Jiang, R Siu, S Tawfick
Physical Review Letters 125 (25), 254503, 2020
122020
Boiling-induced thermal degradation of copper inverse opals and its mitigation
D Kong, K Kim, E Jung, K Jiang, Q Wu, B Jang, HJ Kwon, M Asheghi, ...
International Communications in Heat and Mass Transfer 151, 107250, 2024
72024
Capillary-enhanced two-phase micro-cooler using copper-inverse-opal wick with silicon microchannel manifold for high-heat-flux cooling application
H Kwon, Q Wu, D Kong, S Hazra, K Jiang, S Narumanchi, H Lee, ...
International Communications in Heat and Mass Transfer 156, 107592, 2024
52024
Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites
H Qiao, K Jiang, T Wei, Y Lin, C Perez, M Asheghi, K Goodson
International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023
12023
Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies
M Olyaei, S Singh, K Jiang, Y Gurumukhi, K Goodson, M Asheghi, ...
Journal of Electronic Packaging, 1-43, 2024
2024
Development of a Hybrid Single/Two-phase Capillary-based Micro-cooler using Copper Inverse Opals Wick with Silicon 3D Manifold for High-Heat-Flux Cooling Application
H Kwon, Q Wu, D Kong, S Hazra, K Jiang, C Ahn, S Narumanchi, H Lee, ...
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024
2024
Pool Boiling Reliability Tests and Degradation Mechanisms of Microporous Copper Inverse Opal (CuIOs) Structures
K Jiang, D Kong, K Kim, N Sreekant, J Palko, EM Dede, C Ahn, H Lee, ...
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024
2024
Fabrication and Thermal Characterization of Copper Nanowires (CuNWs) Thermal Interface Materials Tapes
K Jiang, H Kwon, H Qiao, Y He, M Asheghi, K Goodson
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2024
2024
Dynamic elastocapillarity of hairy tubes
J Ha, K Jiang, S Tawfick
APS Division of Fluid Dynamics Meeting Abstracts, A36. 004, 2019
2019
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