| Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling VN Le, L Benabou, V Etgens, QB Tao Microelectronics Reliability, 2016 | 89 | 2016 |
| A thermo-mechanical cohesive zone model for solder joint lifetime prediction L Benabou, Z Sun, PR Dahoo International Journal of Fatigue 49, 18-30, 2013 | 62 | 2013 |
| Investigation of the heel crack mechanism in Al connections for power electronics modules Y Celnikier, L Benabou, L Dupont, G Coquery Microelectronics reliability 51 (5), 965-974, 2011 | 57 | 2011 |
| Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints QB Tao, L Benabou, L Vivet, VN Le, FB Ouezdou Materials Science and Engineering: A 669, 403-416, 2016 | 55 | 2016 |
| Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module VN Le, L Benabou, QB Tao, V Etgens International Journal of Solids and Structures 106, 1-12, 2017 | 48 | 2017 |
| Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni QB Tao, L Benabou, VN Le, H Hwang, DB Luu Journal of Alloys and Compounds 694, 892-904, 2017 | 46 | 2017 |
| Predictions of compressive strength and kink band orientation for wood species L Benabou Mechanics of materials 42 (3), 335-343, 2010 | 42 | 2010 |
| Kink band formation in wood species under compressive loading L Benabou Experimental Mechanics 48, 647-656, 2008 | 39 | 2008 |
| Comparative analysis of damage at interfaces of composites L Benabou, N Benseddiq, M Naıt-Abdelaziz Composites Part B: Engineering 33 (3), 215-224, 2002 | 32 | 2002 |
| Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni QB Tao, L Benabou, TAN Van, H Nguyen-Xuan Journal of Alloys and Compounds 789, 183-192, 2019 | 28 | 2019 |
| Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling Z Sun, L Benabou, PR Dahoo Engineering Fracture Mechanics 107, 48-60, 2013 | 25 | 2013 |
| Systematic review of prosthetic socket fabrication using 3D printing KT Nguyen, L Benabou, S Alfayad Proceedings of the 2018 4th international conference on mechatronics and …, 2018 | 24 | 2018 |
| Development of LSTM networks for predicting viscoplasticity with effects of deformation, strain rate, and temperature history L Benabou Journal of Applied Mechanics 88 (7), 071008, 2021 | 22 | 2021 |
| Sodium dodecyl sulfate (SDS) as an effective corrosion inhibitor for Mg-8Li-3Al alloy in aqueous NaCl: A combined experimental and theoretical investigation H Song, Z Xu, L Benabou, Z Yin, H Guan, H Yan, L Chao, Z Hu, X Wang Journal of Magnesium and Alloys 11 (1), 287-300, 2023 | 21 | 2023 |
| Optimization of wire connections design for power electronics Y Celnikier, L Dupont, E Herve, G Coquery, L Benabou Microelectronics Reliability 51 (9-11), 1892-1897, 2011 | 19 | 2011 |
| Effective properties of a composite with imperfectly bonded interface L Benabou, MN Abdelaziz, N Benseddiq Theoretical and Applied Fracture Mechanics 41 (1-3), 15-20, 2004 | 19 | 2004 |
| Creep behavior of Innolot solder alloy using small lap-shear specimens QB Tao, L Benabou, KL Tan, JM Morelle, F Ben Ouezdou 17th Electronics Packaging Technology Conference, 2015 | 18 | 2015 |
| A design of a new miniature device for solder joints’ mechanical properties evaluation QB Tao, L Benabou, L Vivet, KL Tan, JM Morelle, VN Le, F Ben Ouezdou Proceedings of the Institution of Mechanical Engineers, Part C: Journal of …, 2017 | 17 | 2017 |
| Finite strain analysis of wood species under compressive failure due to kinking L Benabou International Journal of Solids and Structures 49 (3-4), 408-419, 2012 | 17 | 2012 |
| First-principles investigation of intergranular fracture in copper by grain boundary segregation of sulfur X Wang, L Benabou Journal of Engineering Materials and Technology 140 (1), 011008, 2018 | 15 | 2018 |
Quang Bang TaoThe University of Danang - University of Science and Technology在 dut.udn.vn 的电子邮件经过验证
