| Water penetration through a superhydrophobic mesh during a drop impact S Ryu, P Sen, Y Nam, C Lee Physical review letters 118 (1), 014501, 2017 | 113 | 2017 |
| Gallium-based liquid metal alloy incorporating oxide-free copper nanoparticle clusters for high-performance thermal interface materials S Ki, J Shim, S Oh, E Koh, D Seo, S Ryu, J Kim, Y Nam International Journal of Heat and Mass Transfer 170, 121012, 2021 | 54 | 2021 |
| Enhanced heat transfer using metal foam liquid supply layers for micro heat spreaders S Ryu, J Han, J Kim, C Lee, Y Nam International journal of heat and mass transfer 108, 2338-2345, 2017 | 51 | 2017 |
| Performance analysis of gravity-driven oil–water separation using membranes with special wettability S Oh, S Ki, S Ryu, MC Shin, J Lee, C Lee, Y Nam Langmuir 35 (24), 7769-7782, 2019 | 40 | 2019 |
| Heat transfer and capillary performance of dual-height superhydrophilic micropost wicks S Ryu, W Lee, Y Nam International Journal of Heat and Mass Transfer 73, 438-444, 2014 | 25 | 2014 |
| A bio-inspired, low pressure drop liquid cooling system for high-power IGBT modules for EV/HEV applications S Ki, J Lee, S Ryu, S Bang, K Kim, Y Nam International Journal of Thermal Sciences 161, 106708, 2021 | 24 | 2021 |
| Superhydrophilic catenoidal aluminum micropost evaporator wicks S Bang, S Ryu, S Ki, K Song, J Kim, J Kim, Y Nam International Journal of Heat and Mass Transfer 158, 120011, 2020 | 21 | 2020 |
| Anisotropic drop spreading on superhydrophobic grates during drop impact J Han, S Ryu, H Kim, P Sen, D Choi, Y Nam, C Lee Soft Matter 14 (19), 3760-3767, 2018 | 15 | 2018 |
| Influence of early drop bouncing on heat transfer during drop impact YS Ko, J Kim, S Ryu, J Han, Y Nam, C Lee International Communications in Heat and Mass Transfer 137, 106235, 2022 | 7 | 2022 |
| Rapid enhancement of thermal conductivity by incorporating oxide-free copper nanoparticle clusters for highly conductive liquid metal-based thermal interface materials S Ki, J Shim, S Oh, S Ryu, J Kim, Y Nam 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 601-606, 2021 | 3 | 2021 |
| Effective substrate thermal conductivity modeling method extracted from detailed pattern for premium SOC packages S Hwang, B weon Lee, T Kim, Y Hyun, H Hwang, S Ryu, M Choi, Y Kim, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 3 | 2020 |
| Enhanced capillary and heat transfer performance of asymmetric micropost wicks S Bang, J Kim, S Ryu, S Ki, YJ Heo, C Lee, Y Nam International Communications in Heat and Mass Transfer 146, 106935, 2023 | 2 | 2023 |
| Thermal interface material, method of manufacturing the same, and semiconductor packages including the same S Ryu, S Ki, Y Nam, J Kim, B Lee, S Hwang US Patent App. 18/437,385, 2024 | | 2024 |
| Thermal interface material and semiconductor packages including the same S Ryu, S Ki, Y Nam, J Kim, B Lee, S Hwang US Patent 11,935,812, 2024 | | 2024 |
| Oxide-Free Copper Nanoparticle Incorporated Gallium-Based Liquid Metal Alloy for High-Performance Thermal Interface Materials S Ki, Y Nam, J Shim, S Oh, S Ryu, J Kim 2021 Materials Research Society (MRS) Fall Meeting & Exhibit, 2021 | | 2021 |
| Aluminum micropost wicks with a circular hyperboloid shape for micro heat spreaders S Bang, S Ryu, Y Nam International Heat Transfer Conference Digital Library, 2018 | | 2018 |
| Compact liquid cooling system for high power IGBT modules in EV/HEV applications S Ki, J Lee, S Ryu, Y Nam International Heat Transfer Conference Digital Library, 2018 | | 2018 |
| Capillary and Thermal Performance of Advanced Multi-Height Micropost Evaporator Wicks S Ryu, W Lee, Y Nam International Heat Transfer Conference Digital Library, 2014 | | 2014 |
