| Cu clip-bonding method with optimized source inductance for current balancing in multichip SiC MOSFET power module L Wang, T Zhang, F Yang, D Ma, C Zhao, Y Pei, Y Gan IEEE Transactions on Power Electronics 37 (7), 7952-7964, 2022 | 41 | 2022 |
| Direct integration of optimized phase-change heat spreaders into SiC power module for thermal performance improvements under high heat flux W Mu, L Wang, B Wang, T Zhang, F Yang, Y Gan, H Zhang IEEE Transactions on Power Electronics 37 (5), 5398-5410, 2021 | 30 | 2021 |
| A Highly Integrated Multichip SiC MOSFET Power Module With Optimized Electrical and Thermal Performances D Ma, G Xiao, T Zhang, F Yang, M Zhu, T Yuan, L Ma, Y Gan, L Wang IEEE Journal of Emerging and Selected Topics in Power Electronics 11 (2 …, 2022 | 20 | 2022 |
| Compact-Interleaved Packaging Method of Power Module With Dynamic Characterization of 4H-SiC MOSFET and Development of Power Electronic Converter at Extremely High Junction … F Yang, L Wang, H Kong, M Zhu, X Liu, X Lu, M Qin, T Zhang, Y Gan, L Jia IEEE Transactions on Power Electronics 38 (1), 417-434, 2022 | 16 | 2022 |
| The study on thermal coupling effect for SiC power module design guidelines F Yang, L Jia, L Wang, C Zhao, J Wang, T Zhang, Y Gan, H Zhang 2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2020 | 7 | 2020 |
| Objective-Based Low-Frequency Parasitic Inductance Characterization Method for Power Semiconductor Package With High Power and Switching Speed F Yang, L Wang, Z Cheng, H Cui, T Zhang, H Kong, Y Gan, L Jia IEEE Transactions on Power Electronics 38 (6), 6886-6890, 2023 | 3 | 2023 |
