| Design of a novel freeform lens for LED uniform illumination and conformal phosphor coating R Hu, X Luo, H Zheng, Z Qin, Z Gan, B Wu, S Liu Optics Express 20 (13), 13727-13737, 2012 | 124 | 2012 |
| Effects of moist environments on LED module reliability X Luo, B Wu, S Liu IEEE Transactions on device and materials reliability 10 (2), 182-186, 2009 | 92 | 2009 |
| Effect of gold wire bonding process on angular correlated color temperature uniformity of white light-emitting diode B Wu, X Luo, H Zheng, S Liu Optics Express 19 (24), 24115-24121, 2011 | 26 | 2011 |
| Thermal deformation analysis of automotive electronic control units subjected to passive and active thermal conditions B Wu, DS Kim, B Han, A Palczynska, PJ Gromala 2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015 | 23 | 2015 |
| Effect mechanism of moisture diffusion on LED reliability B Wu, X Luo, S Liu 3rd Electronics System Integration Technology Conference ESTC, 1-5, 2010 | 18 | 2010 |
| Advanced mechanical/optical configuration of real-time moire interferometry for thermal deformation analysis of fan-out wafer level package B Wu, B Han IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (5 …, 2018 | 14 | 2018 |
| Effect investigation of delamination on optical output of high power LEDs B Wu, X Luo, Z Zhao, S Liu 2011 12th International Conference on Electronic Packaging Technology and …, 2011 | 13 | 2011 |
| Accuracy of CMOS-based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation A Prisacaru, A Hellermann, P Gromala, B Wu, B Han, GQ Zhang IEEE Sensors Journal, 2019 | 12 | 2019 |
| Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In Situ Load Counter B Wu, DS Kim, B Han, A Palczynska, A Prisacaru, PJ Gromala IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018 | 12 | 2018 |
| Measurement of anisotropic coefficients of thermal expansion of SAC305 solder using surface strains of single grain with arbitrary orientation B Wu, YH Yang, B Han, J Schumacher Acta Materialia 156, 196-204, 2018 | 11 | 2018 |
| A method for geometry control of phosphor layer in high-power white LEDs by package structure H Zheng, X Fu, B Wu, S Liu, X Luo 2012 14th International Conference on Electronic Materials and Packaging …, 2012 | 11 | 2012 |
| Prediction of statistical distribution of vibration-induced solder fatigue failure considering intrinsic variations of mechanical properties of anisotropic Sn-Rich solder alloys HP Wei, YH Yang, B Wu, B Han 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 741-747, 2018 | 9 | 2018 |
| Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages K Mahan, B Kim, B Wu, B Han, I Kim, H Moon, YN Hwang Microelectronics Reliability 63, 134-141, 2016 | 8 | 2016 |
| Application of the IForce piezoresistive silicon based stress sensor for prognostic and health monitoring methods A Palczynska, B Wu, DS Kim, P Gromala, B Han, D Mayer, T Melz 2015 European Microelectronics Packaging Conference (EMPC), 1-6, 2015 | 8 | 2015 |
| Moisture transport through housing materials enclosing critical automotive electronics A Roman, B Wu, B Han, GM Reinacher, SG Yousef IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 7 | 2020 |
| Hybrid approach to conduct failure prognostics of automotive electronic control unit B Wu, DS Kim, B Han, A Palczynska, A Prisacaru, PJ Gromala Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 476-482, 2017 | 4 | 2017 |
| Advancement of Moiré Interferometry for Rate-Dependent Material Behavior and Micromechanical Deformations B Wu University of Maryland, College Park, 2018 | 3 | 2018 |
| Simulation Driven Design of Novel Integrated Circuits-Part 4: Method of Validation of Coupled Thermal and Thermo-mechanical Simulation P Gromala, A Palczynska, B Wu, B Han 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 2 | 2018 |
| Measurements of Inelastic Strain Evolution of Single Solder Grain Subject to Nominal Shear Loading B Wu, B Han, J Schumacher Experimental Mechanics 59, 1075-1086, 2019 | 1 | 2019 |
| Effects of Underfill on Thermo-Mechanical Behavior of Fan-out Wafer Level Package Used in PoP: An Experimental Study by Advancements of Real-Time Moiré Interferometry B Wu, B Han 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1615-1622, 2018 | 1 | 2018 |
