| A review of 5G front-end systems package integration AO Watanabe, M Ali, SYB Sayeed, RR Tummala, MR Pulugurtha IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 168 | 2020 |
| First demonstration of compact, ultra-thin low-pass and bandpass filters for 5G small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ... IEEE Microwave and Wireless Components Letters 28 (12), 1110-1112, 2018 | 67 | 2018 |
| Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias AO Watanabe, TH Lin, M Ali, Y Wang, V Smet, PM Raj, MM Tentzeris, ... IEEE Transactions on Microwave Theory and Techniques 68 (12), 5082-5092, 2020 | 51 | 2020 |
| Broadband and miniaturized antenna-in-package (AiP) design for 5G applications TH Lin, K Kanno, AO Watanabe, PM Raj, RR Tummala, M Swaminathan, ... IEEE Antennas and Wireless Propagation Letters 19 (11), 1963-1967, 2020 | 43 | 2020 |
| First demonstration of 28 GHz and 39 GHz transmission lines and antennas on glass substrates for 5G modules AO Watanabe, M Ali, B Tehrani, J Hester, H Matsuura, T Ogawa, PM Raj, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 236-241, 2017 | 41 | 2017 |
| Miniaturized high-performance filters for 5G small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1068-1075, 2018 | 33 | 2018 |
| Glass-based IC-embedded antenna-integrated packages for 28-GHz high-speed data communications AO Watanabe, M Ali, R Zhang, S Ravichandran, T Kakutani, PM Raj, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 89-94, 2020 | 32 | 2020 |
| Characterization of ABF/glass/ABF substrates for mmWave applications M ur Rehman, S Ravichandran, AO Watanabe, S Erdogan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 31 | 2021 |
| Leading-edge and ultra-thin 3D glass-polymer 5G modules with seamless antenna-to-transceiver signal transmissions A Watanabe, TH Lin, PM Raj, V Sundaram, MM Tentzeris, RR Tummala, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2026-2031, 2018 | 29 | 2018 |
| Nanostructured miniaturized artificial magnetic conductors (AMC) for high-performance antennas in 5G, IoT, and smart skin applications TH Lin, PM Raj, A Watanabe, V Sundaram, R Tummala, MM Tentzeris 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO), 911-915, 2017 | 23 | 2017 |
| Package-integrated, wideband power dividing networks and antenna arrays for 28-GHz 5G new radio bands M Ali, AO Watanabe, TH Lin, D Okamoto, MR Pulugurtha, MM Tentzeris, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 22 | 2020 |
| Innovative Sub-5- m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects F Liu, G Khurana, R Zhang, A Watanabe, BH DeProspo, C Nair, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 22 | 2019 |
| Highly-effective integrated EMI shields with graphene and nanomagnetic multilayered composites AO Watanabe, S Jeong, S Kim, Y Kim, J Min, D Wong, MR Pulugurtha, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 206-210, 2016 | 22 | 2016 |
| Ultralow-loss substrate-integrated waveguides in glass-based substrates for millimeter-wave applications AO Watanabe, BK Tehrani, T Ogawa, PM Raj, MM Tentzeris, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 20 | 2020 |
| Advanced low-loss and high-density photosensitive dielectric material for RF/millimeter-wave applications H Ito, K Kanno, A Watanabe, R Tsuyuki, R Tatara, M Raj, RR Tummala 2019 International Wafer Level Packaging Conference (IWLPC), 1-6, 2019 | 20 | 2019 |
| Interfacial spin-glass-like state in single crystalline films grown on germanium substrates A Truong, AO Watanabe, PA Mortemousque, K Ando, T Sato, T Taniyama, ... Physical Review B 91 (21), 214425, 2015 | 17 | 2015 |
| Advanced low loss dielectric material reliability and filter characteristics at high frequency for mmWave applications T Kakutani, D Okamoto, Z Guan, Y Suzuki, M Ali, A Watanabe, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 653-659, 2020 | 16 | 2020 |
| Heterogeneous integration of 5G and millimeter-wave diplexers with 3D glass substrates M Ali, A Watanabe, T Kakutani, PM Raj, RR Tummala, M Swaminathan 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1376-1382, 2020 | 15 | 2020 |
| Multilayered electromagnetic interference shielding structures for suppressing magnetic field coupling AO Watanabe, PM Raj, D Wong, R Mullapudi, R Tummala Journal of Electronic Materials 47, 5243-5250, 2018 | 15 | 2018 |
| Sintered nanocopper paste for high-performance 3D heterogeneous package integration Y Wang, AO Watanabe, N Ogura, PM Raj, R Tummala Journal of Electronic Materials 49, 6737-6745, 2020 | 14 | 2020 |
Rao Tummala在 ece.gatech.edu 的电子邮件经过验证
