| Millimeter wave integrated circuit with ball grid array package including transmit and receive channels RM Murugan, M Mi, GP Morrison, J Chen, KR Rhyner, SC Beddingfield, ... US Patent 9,666,553, 2017 | 56 | 2017 |
| Rotational transition based clock, rotational spectroscopy cell, and method of making same JA Herbsommer, BS Cook, P Nadeau, SJ Jacobs, DE Trombley US Patent 9,529,334, 2016 | 31 | 2016 |
| A physical understanding of RF noise in bulk nMOSFETs with channel lengths in the nanometer regime VM Mahajan, PR Patalay, RP Jindal, H Shichijo, S Martin, FC Hou, ... IEEE transactions on electron devices 59 (1), 197-205, 2011 | 28 | 2011 |
| Integrated high-frequency reference clock systems utilizing mirror-encapsulated BAW resonators ETT Yen, K Martin, M Chowdhury, J Segovia-Fernandez, D Griffith, ... 2019 IEEE International Ultrasonics Symposium (IUS), 2174-2177, 2019 | 24 | 2019 |
| Active detection techniques for photoacoustic sensors CM Hung, D Trombley US Patent 8,434,366, 2013 | 18 | 2013 |
| Detection and locking to the absorption spectra of gasses using quartz enhanced photoacoustic sprectroscopy D Trombley, PM Nadeau US Patent App. 13/926,516, 2014 | 16 | 2014 |
| Temperature compensated bulk acoustic wave resonator with a high coupling coefficient SM Jacobsen, RL Wise, M Wang, RA Jackson, NS Dellas, DE Trombley US Patent 9,929,714, 2018 | 12 | 2018 |
| High-frequency noise measurements on MOSFETs with channel-lengths in sub-100 nm regime PR Patalay, RP Jindal, H Shichijo, S Martin, FC Hou, D Trombley 2009 2nd International Workshop on Electron Devices and Semiconductor …, 2009 | 11 | 2009 |
| Numerical investigation of excess RF channel noise in sub-100 nm MOSFETs VM Mahajan, RP Jindal, H Shichijo, S Martin, FC Hou, D Trombley 2009 2nd International Workshop on Electron Devices and Semiconductor …, 2009 | 9 | 2009 |
| System co-design of a 600V GaN FET power stage with integrated driver in a QFN system-in-package (QFN-SiP) J Chen, Y Xie, D Trombley, R Murugan 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1221-1226, 2019 | 7 | 2019 |
| Semiconductor package with printed sensor BS Cook, JA Herbsommer, D Trombley, SA Kummerl, P Emerson US Patent 9,646,906, 2017 | 6 | 2017 |
| Pressure sensing using quantum molecular rotational state transitions BS Cook, D Trombley, AJ Fruehling, JA Herbsommer US Patent 10,551,265, 2020 | 2 | 2020 |
| Semiconductor device with an integrated deep trench capacitor having high capacitance density and low equivalent series resistance B Hu, Y Pan, D Trombley US Patent 11,222,986, 2022 | 1 | 2022 |
| Millimeter wave integrated circuit with ball grid array package including transmit and receive channels RM Murugan, M Mi, GP Morrison, J Chen, KR Rhyner, SC Beddingfield, ... US Patent 9,941,228, 2018 | 1 | 2018 |
| Semiconductor device with an integrated deep trench capacitor having high capacitance density and low equivalent series resistance B Hu, Y Pan, D Trombley US Patent 11,742,436, 2023 | | 2023 |
| Millimeter wave integrated circuit with ball grid array package including transmit and receive channels RM Murugan, M Mi, GP Morrison, J Chen, KR Rhyner, SC Beddingfield, ... US Patent 10,262,957, 2019 | | 2019 |
| IC, process, device generating frequency reference from RF gas absorption PM Nadeau, D Trombley, BS Haroun, SM Ramaswamy US Patent 9,325,334, 2016 | | 2016 |
| A novel and accurate methodology for design and characterization of wire-bond package performance for 5–10GHz applications S Mukherjee, D Trombley 2013 IEEE 63rd Electronic Components and Technology Conference, 1379-1384, 2013 | | 2013 |
