| Effect of graphene nanosheets reinforcement on the performance of Sn Ag Cu lead-free solder XD Liu, YD Han, HY Jing, J Wei, LY Xu Materials Science and Engineering: A 562, 25-32, 2013 | 170 | 2013 |
| Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging X Liu, H Nishikawa Scripta materialia 120, 80-84, 2016 | 140 | 2016 |
| Thermally stable Cu3Sn/Cu composite joint for high-temperature power device X Liu, S He, H Nishikawa Scripta Materialia 110, 101-104, 2016 | 94 | 2016 |
| Enhancing and suppressing effects of an inner droplet on deformation of a double emulsion droplet under shear Y Chen, X Liu, C Zhang, Y Zhao Lab on a Chip 15 (5), 1255-1261, 2015 | 63 | 2015 |
| Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach X Liu, S He, H Nishikawa Journal of Alloys and Compounds 695, 2165-2172, 2017 | 60 | 2017 |
| Microscale Ag particle paste for sintered joints in high-power devices H Nishikawa, X Liu, X Wang, A Fujita, N Kamada, M Saito Materials Letters 161, 231-233, 2015 | 58 | 2015 |
| Effects of graphene nanosheets on interfacial reaction of Sn–Ag–Cu solder joints L Xu, L Wang, H Jing, X Liu, J Wei, Y Han Journal of Alloys and Compounds 650, 475-481, 2015 | 58 | 2015 |
| Influence of gravity on gas–liquid two-phase flow in horizontal pipes X Liu, Y Chen, M Shi International journal of multiphase flow 41, 23-35, 2012 | 26 | 2012 |
| Pressureless sintering bonding using hybrid microscale Cu particle paste on ENIG, pure Cu and pre-oxidized Cu substrate by an oxidation–reduction process X Liu, H Nishikawa Journal of Materials Science: Materials in Electronics 28, 5554-5561, 2017 | 25 | 2017 |
| Analysis of gas-particle flow characteristics in impinging streams X Liu, Y Chen, Y Chen Chemical Engineering and Processing: Process Intensification 79, 14-22, 2014 | 18 | 2014 |
| Improved joint strength with sintering bonding using microscale Cu particles by an oxidation-reduction process X Liu, H Nishikawa 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 455-460, 2016 | 11 | 2016 |
| Thermal stability of low-temperature sintered joint using Sn-coated Cu particles during isothermal aging at 250° C X Liu, S Zhou, H Nishikawa Journal of Materials Science: Materials in Electronics 28, 12606-12616, 2017 | 10 | 2017 |
| Effect of bonding conditions on shear strength of joints at 200° C using Sn-coated Cu particle H Nishikawa, X Liu, S He 2017 21st European Microelectronics and Packaging Conference (EMPC …, 2017 | 5 | 2017 |
| Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging X Liu, H Nishikawa International Symposium on Microelectronics 2015 (1), 000449-000452, 2015 | 5 | 2015 |
| The evaluation of mechanical properties of Sn58BiXTi solder by tensile test S Zhou, X Liu, O Mokhtari, H Nishikawa 2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017 | 3 | 2017 |
| Low temperature bonding using microscale Cu particles coated with thin Sn layers at 200° C X Liu, S He, H Nishikawa 2016 International Conference on Electronics Packaging (ICEP), 306-309, 2016 | 3 | 2016 |
| Effect of isothermal aging at 250° C on shear strength of joints using Sn-Coated Cu particle paste for high-temperature application H Nishikawa, X Liu, S He Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2017 (HiTEN …, 2017 | 2 | 2017 |
| Explore African American-White Difference in Mathematics Content Domain and Item Difficulty Level: DIF Evidence. X Liu, S Dunbar | | |
| Administration Mode Comparability Study for Mathematics in K-2 Populations X Liu, C Welch, S Dunbar | | |
| Dewey’s Conception of Moral Deliberation and its Implications for Moral Education X Liu | | |
Siliang HeGuilin University of Electronic Technology在 guet.edu.cn 的电子邮件经过验证
Siliang HeGuilin University of Electronic Technology在 guet.edu.cn 的电子邮件经过验证
Omid MokhtariNoxware Ltd.