| Flux effect on void quantity and size in soldered joints D Bušek, K Dušek, D Růžička, M Plaček, P Mach, J Urbánek, J Starý Microelectronics Reliability 60, 135-140, 2016 | 76 | 2016 |
| Solder joint quality evaluation based on heating factor P Veselý, E Horynová, J Starý, D Bušek, K Dušek, V Zahradník, M Plaček, ... Circuit World 44 (1), 37-44, 2018 | 39 | 2018 |
| Analysis of no-clean flux spatter during the soldering process P Veselý, D Bušek, O Krammer, K Dušek Journal of materials processing technology 275, 116289, 2020 | 34 | 2020 |
| Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis K Dušek, D Bušek Microelectronics Reliability 56, 162-169, 2016 | 25 | 2016 |
| Study of the components self-alignment in surface mount technology K Dušek, M Novak, A Rudajevova 2012 35th International Spring Seminar on Electronics Technology, 197-200, 2012 | 24 | 2012 |
| The effect of solder paste particle size on the thixotropic behaviour during stencil printing O Krammer, B Gyarmati, A Szilágyi, B Illés, D Bušek, K Dušek Journal of materials processing technology 262, 571-576, 2018 | 22 | 2018 |
| The influence of the crystallographic structure of the intermetallic grains on tin whisker growth B Illés, A Skwarek, J Ratajczak, K Dušek, D Bušek Journal of Alloys and Compounds 785, 774-780, 2019 | 19 | 2019 |
| Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect) K Dušek, D Bušek, M Plaček, A Géczy, O Krammer, B Illés Journal of Materials Processing Technology 251, 20-25, 2018 | 17 | 2018 |
| Corrosion-induced tin whisker growth in electronic devices: A review B Illés, B Horváth, A Géczy, O Krammer, K Dušek Soldering & Surface Mount Technology 29 (1), 59-68, 2017 | 17 | 2017 |
| Surface tension measurement of the solders by non-wetting specimen K Dusek, J Urbanek 2008 31st International Spring Seminar on Electronics Technology, 354-357, 2008 | 17 | 2008 |
| New method for determining correction factors for pin-in-paste solder volumes O Krammer, B Varga, K Dušek Soldering & Surface Mount Technology 29 (1), 2-9, 2017 | 16 | 2017 |
| Measurements of the solders surface tension values J Urbanek, K Dusek EuroSime 2006-7th International Conference on Thermal, Mechanical and …, 2006 | 16 | 2006 |
| Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation B Illés, B Medgyes, K Dušek, D Bušek, A Skwarek, A Géczy International Journal of Heat and Mass Transfer 184, 122268, 2022 | 15 | 2022 |
| Influence of manufacturing mechanical and thermal histories on dimensional stabilities of FR4 laminate and FR4/Cu-plated holes A Rudajevová, K Dušek Materials 11 (11), 2114, 2018 | 15 | 2018 |
| Effect of Cu substrate roughness and Sn layer thickness on whisker development from Sn thin-films B Illés, T Hurtony, O Krammer, B Medgyes, K Dušek, D Bušek Materials 12 (21), 3609, 2019 | 14 | 2019 |
| Influence of latent heat released from solder joints on the reflow temperature profile K Dušek, A Rudajevová, M Plaček Journal of Materials Science: Materials in Electronics 27, 543-549, 2016 | 14 | 2016 |
| Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system B Illés, A Skwarek, A Géczy, L Jakab, D Bušek, K Dušek Soldering & Surface Mount Technology 30 (2), 66-73, 2018 | 13 | 2018 |
| Influence of type of reflow technology and type of surface finish on tomb stone effect K Dušek, V Straka, M Brejcha, IB Pelikanova Proceedings of the 36th International Spring Seminar on Electronics …, 2013 | 13 | 2013 |
| Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing O Krammer, B Gyarmati, A Szilágyi, R Storcz, L Jakab, B Illés, A Géczy, ... Soldering & Surface Mount Technology 29 (1), 10-14, 2017 | 12 | 2017 |
| Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy B Illés, H Choi, T Hurtony, K Dušek, D Bušek, A Skwarek Journal of Materials Research and Technology 20, 4231-4240, 2022 | 11 | 2022 |
