| Porosity effect on the mechanical properties of nano-silver solder W Lv, J Hu, J Liu, C Xiong, F Zhu Nanotechnology 34 (16), 165701, 2023 | 11 | 2023 |
| Specular surface deformation measurement based on projected-speckle deflectometry with digital image correlation C Xiong, Y Gao, F Zhu Optics and Lasers in Engineering 170, 107776, 2023 | 7 | 2023 |
| Optimized super-resolution promote accuracy for projection speckle three-dimensional digital image correlation Y Gao, C Xiong, X Lei, Y Huang, W Lv, F Zhu Measurement Science and Technology 34 (11), 115601, 2023 | 5 | 2023 |
| Convolutional neural network with attention module for identification of tunnel seepage Q Chen, C Xiong, W Lv, B Shen, B Zeng, J Li, C Feng, Z Hu, F Zhu Transportation Research Record 2676 (11), 112-123, 2022 | 5 | 2022 |
| A full-field warpage characterization measurement method coupled with infrared information B Zeng, Y Gao, C Xiong, X Lei, W Lv, F Zhu Microelectronics Reliability 149, 115237, 2023 | 4 | 2023 |
| A non-destructive inspection method for electronic packaging reliability incorporating mechanical and thermal information C Xiong, B Zeng, Y Huang, F Zhu 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 719-724, 2022 | 3 | 2022 |
| Design and optimization of a novel MEMS tuning fork gyroscope microstructure C Xiong, P Zeng, W Lv, F Lu, M Zhang, Y Huang, F Zhu Micromachines 13 (2), 172, 2022 | 3 | 2022 |
| Atomistic simulations of the thinning process of tantalum/copper heterostructure in wafer containing through silicon via K Xu, Y Zhou, Z Yu, Y Gao, Y Chen, X Lei, C Xiong, W Lv, F Zhu Applied Surface Science 676, 161026, 2024 | 1 | 2024 |
| Electrical contact reliability investigation of high-speed electrical connectors under fretting wear behavior X Lei, C Feng, W Lv, Y Zhou, C Xiong, Y Gao, F Zhu Microelectronics Reliability 162, 115510, 2024 | 1 | 2024 |
| In-Situ Warpage Measurement of Electronic Packages with Projected Speckle DIC and Deep Learning-Based ROI Identification Y Gao, C Xiong, W Lv, K Xu, X Lei, F Zhu IEEE Transactions on Instrumentation and Measurement, 2024 | | 2024 |
| Correction of thermal airflow distortion in warpage measurements of microelectronic packaging structures via deep learning-based digital image correlation Y Gao, Y Chen, Z Yu, C Xiong, X Lei, W Lv, S Liu, F Zhu Microsystems & Nanoengineering 10 (1), 118, 2024 | | 2024 |
