Kim S Siow 个人学术档案 - 学术资源搜索

引用次数

	总计	2019 年至今
引用	3728	2074
h 指数	23	19
i10 指数	41	37

440

220

110

330

200620072008200920102011201220132014201520162017201820192020202120222023202412 31 41 63 77 104 99 129 158 173 220 213 305 351 316 323 375 436 270

开放获取的出版物数量

查看全部

11 篇文章

4 篇文章

可查看的文章

无法查看的文章

根据资助方的强制性开放获取政策

合著作者

Mohd Farhanulhakim Mohd Razip WeeInstitute of Microengineering and Nanoelectronics (IMEN)在 ukm.edu.my 的电子邮件经过验证
Pei Yuen NgUKM Faculty of Pharmacy在 ukm.edu.my 的电子邮件经过验证
Ebrahim MahmoudiSenior Lecturer, Universiti Kebangsaan Malaysia Department of Chemical and Process Engineering在 ukm.edu.my 的电子邮件经过验证
Zuruzi Abu SamahAlfaisal University, Kingdom of Saudi Arabia在 alfaisal.edu 的电子邮件经过验证
Yunhui Mei or Yun-Hui MeiTianjin Unversity and Tiangong University在 tju.edu.cn 的电子邮件经过验证
Lee Khai ErnProfessor, Universiti Kebangsaan Malaysia在 ukm.edu.my 的电子邮件经过验证
GQ Lu or Guo-Quan Lu or G-Q LuVirginia Tech ECE and MSE在 vt.edu 的电子邮件经过验证
Mohd Ambri MohamedInstitute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia在 ukm.edu.my 的电子邮件经过验证
Amir ZulkefliStaff Engineer at Infineon Technologies | Reliability Engineering在 infineon.com 的电子邮件经过验证
Prof. Abdelkrim KhelifCNRS在 femto-st.fr 的电子邮件经过验证
Dr Ahmad Rifqi Md ZainIMEN, Universiti Kebangsaan Malaysia (UKM)在 ukm.edu.my 的电子邮件经过验证
Mahmoud AddoucheFEMTO-ST, CNRS在 femto-st.fr 的电子邮件经过验证
Mazlin Bin MokhtarProfessor of Environmental Chemistry, Universiti Kebangsaan Malaysia在 ukm.edu.my 的电子邮件经过验证
Abdul Wahab Mohammad, FAScProfessor, Chemical Engineering and Desalination, University of Sharjah在 sharjah.ac.ae 的电子邮件经过验证
gires usupProfessor of Marine Science, Universiti Kebangsaan Malaysia在 ukm.edu.my 的电子邮件经过验证
Xin LiTianjin University在 tju.edu.cn 的电子邮件经过验证
Azrul Azlan HamzahProfessor of Microelectromechanical Systems (MEMS), IMEN, Universiti Kebangsaan Malaysia在 ukm.edu.my 的电子邮件经过验证
Muhamad Ramdzan BuyongInstitute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia在 ukm.edu.my 的电子邮件经过验证
Chwee Teck (C.T.) LimNUSS Professor, FRS FNAI FAIMBE FIAMBE FAAET FSAE FSNAS FIUPESM FIES在 nus.edu.sg 的电子邮件经过验证
Nai Mui HoonBME, NUS在 nus.edu.sg 的电子邮件经过验证

关注

Kim S Siow

Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (National

在 ukm.edu.my 的电子邮件经过验证

sintered silver electronics packaging mechanical behavior of materials plasma treatment


标题按引用次数排序按年份排序按标题排序	引用次数引用次数	年份
Plasma methods for the generation of chemically reactive surfaces for biomolecule immobilization and cell colonization‐a review KS Siow, L Britcher, S Kumar, HJ Griesser Plasma processes and polymers 3 (6‐7), 392-418, 2006	1145	2006
Mechanical properties of nano-silver joints as die attach materials KS Siow Journal of Alloys and Compounds 514, 6-19, 2012	432	2012
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? KS Siow Journal of Electronic Materials 43 (4), 947-961, 2014	343	2014
Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300° C ST Chua, KS Siow Journal of Alloys and Compounds 687, 486-498, 2016	179	2016
Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study KS Siow, YT Lin Journal of Electronic Packaging 138 (2), 020804, 2016	162	2016
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints TF Chen, KS Siow Journal of Alloys and Compounds 866, 158783, 2021	138	2021
XPS Study of Sulfur and Phosphorus Compounds with Different Oxidation States K SIOW, L Britcher, S Kumar, H JGriesser Sains Malaysiana 47 (8), 1913-1922, 2018	134	2018
Mechanical properties of nanocrystalline copper and nickel KS Siow, AAO Tay, P Oruganti Materials science and technology 20 (3), 285-294, 2004	86	2004
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging KS Siow Materials, Process, Equipment, and Reliability, Springer International …, 2019	74	2019
Low‐Pressure Plasma Methods for Generating Non‐Reactive Hydrophilic and Hydrogel‐Like Bio‐Interface Coatings–A Review KS Siow, S Kumar, HJ Griesser Plasma Processes and Polymers 12 (1), 8-24, 2015	71	2015
Sulfonated Surfaces by Sulfur Dioxide Plasma Surface Treatment of Plasma Polymer Films KS Siow, L Britcher, S Kumar, HJ Griesser Plasma Processes and Polymers 6 (9), 583-592, 2009	64	2009
Deposition and XPS and FTIR Analysis of Plasma Polymer Coatings Containing Phosphorus KS Siow, L Britcher, S Kumar, HJ Griesser Plasma Processes and Polymers 11 (2), 133-141, 2014	56	2014
Plasma polymerized carvone as an antibacterial and biocompatible coating YW Chan, KS Siow, PY Ng, U Gires, BY Majlis Materials Science and Engineering: C 68, 861-871, 2016	55	2016
QCM-D and XPS study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups KS Siow, L Britcher, S Kumar, HJ Griesser Colloids and Surfaces B: Biointerfaces 173, 447-453, 2019	50	2019
Pitting corrosion of duplex stainless steels KS Siow, TY Song, JH Qiu Anti Corrosion Methods and Materials 48 (1), 31-37, 2001	50	2001
Rapid sintering of nano-Ag paste at low current to bond large area (>100 mm²) power chips for electronics packaging Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu Journal of Materials Processing Technology 255, 644-649, 2018	44	2018
Electrical conductivity of porous silver made from sintered nanoparticles AS Zuruzi, KS Siow Electronic Materials Letters 11 (2), 308-314, 2015	38	2015
Public benefit and risk perceptions of nanotechnology development: Psychological and sociological aspects NA Kamarulzaman, KE Lee, KS Siow, M Mokhtar Technology in Society 62, 101329, 2020	37	2020
Thermal Cycling of Sintered Silver (Ag) Joint as Die-Attach Material KS Siow, ST Chua JOM 71 (9), 3066-3075, 2019	32	2019
Low Pressure Plasma Modifications for the Generation of Hydrophobic Coatings for Biomaterials Applications KS Siow Plasma Processes and Polymers, https://doi.org/10.1002/ppap.201800059, 2018	31	2018

系统目前无法执行此操作，请稍后再试。

文章 1–20

每年引用数

重复的引用

合并的引用

添加合著者合著作者

上传 PDF

关注此作者

引用次数

合著作者

引用