| Effect of covalent functionalization on thermal transport across graphene–polymer interfaces Y Wang, HF Zhan, Y Xiang, C Yang, CM Wang, YY Zhang The journal of physical chemistry C 119 (22), 12731-12738, 2015 | 162 | 2015 |
| Effect of non-covalent functionalisation on thermal and mechanical properties of graphene-polymer nanocomposites Y Wang, C Yang, YW Mai, Y Zhang Carbon 102, 311-318, 2016 | 135 | 2016 |
| Some aspects of thermal transport across the interface between graphene and epoxy in nanocomposites Y Wang, C Yang, QX Pei, Y Zhang ACS applied materials & interfaces 8 (12), 8272-8279, 2016 | 122 | 2016 |
| A molecular dynamics study on thermal and mechanical properties of graphene–paraffin nanocomposites Y Wang, C Yang, Y Cheng, Y Zhang RSC advances 5 (101), 82638-82644, 2015 | 65 | 2015 |
| Formation of carbon nanoscrolls from graphene nanoribbons: A molecular dynamics study Y Wang, HF Zhan, C Yang, Y Xiang, YY Zhang Computational Materials Science 96, 300-305, 2015 | 36 | 2015 |
| Process and pad design optimization for 01005 passive component surface mount assembly Y Wang, M Olorunyomi, M Dahlberg, Z Djurovic, J Anderson, J Liu Soldering & surface mount technology 19 (1), 34-44, 2007 | 20 | 2007 |
| Development of ontology for the anisotropic conductive adhesive interconnect technology in electronics applications J Liu, Y Wang, J Morris, H Kristiansen Proceedings. International Symposium on Advanced Packaging Materials …, 2005 | 16 | 2005 |
| Electrical properties of Si-XII and Si-III formed by nanoindentation Y Wang, S Ruffell, K Sears, AP Knights, JE Bradby, JS Williams 2010 Conference on Optoelectronic and Microelectronic Materials and Devices …, 2010 | 8 | 2010 |
| IMC formation between electroless Ni/Pd/Au surface finish and SnAgCu solder J Mao, B Liu, M Li, Y Wang, D Mao 2008 International Conference on Electronic Packaging Technology & High …, 2008 | 8 | 2008 |
| Thermal conductivity of graphene and its polymer nanocomposites: A review Y Zhang, Y Wang, CM Wang, Y Gu Advanced Computational Nanomechanics, 1-28, 2016 | 7 | 2016 |
| An electrical design and fabrication of a 12-channel optical transceiver with SiP packaging technology W Gao, Z Li, J Song, X Zhang, F Chen, F Liu, Y Zhou, J Li, H Xiang, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 7 | 2010 |
| Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications J Liu, Y Wang, J Morris, H Kristiansen 2005 Conference on High Density Microsystem Design and Packaging and …, 2005 | 7 | 2005 |
| Superior thermal conductivity of carbon nanoscroll based thermal interface materials Y Wang, Y Zhang 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1234-1239, 2015 | 6 | 2015 |
| A study on the application of soldering flux on the solder balls of BGA packages Y Wang, L Cao 2010 11th International Conference on Electronic Packaging Technology & High …, 2010 | 5 | 2010 |
| Numerical modeling study of heat transfer and binding behavior across the interface between epoxy and graphene in thermal interface materials Y Wang Heat Transfer Rsearch 52 (11), 1-11, 2021 | 4* | 2021 |
| Multiscale modeling on the enhanced heat transfer behavior of thermal interface materials based on graphene Y Wang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2171-2177, 2021 | 2 | 2021 |
| Development of high speed cold ball pull as a quick turn monitor for solder joint reliability Y Wang, L Cao 2009 International Conference on Electronic Packaging Technology & High …, 2009 | 2 | 2009 |
| Dynamic bending tests and numerical simulation of board level electronic package F Qin, Y Wang, B Liu, T An, L Jin 2008 International Conference on Electronic Packaging Technology & High …, 2008 | 2 | 2008 |
Yingyan Zhang (张莺燕）Professor in School of Engineering, RMIT University, Australia; Editor in Thin-Walled Structures在 rmit.edu.au 的电子邮件经过验证
