| Steady-state heat conduction in multi-layer bodies A Haji-Sheikh, JV Beck, D Agonafer International Journal of Heat and Mass Transfer 46 (13), 2363-2379, 2003 | 135 | 2003 |
| A brief overview of recent developments in thermal management in data centers S Alkharabsheh, J Fernandes, B Gebrehiwot, D Agonafer, K Ghose, ... Journal of Electronic Packaging 137 (4), 040801, 2015 | 124 | 2015 |
| Convertible cooling module for air or water cooling of electronic circuit components D Agonafer, TM Anderson, GM Chrysler, RCF Chu, RE Simons, DT Vader US Patent 5,370,178, 1994 | 114 | 1994 |
| Isothermal heat sink with tiered cooling channels D Agonafer, RC Chu, MJ Ellsworth Jr, RE Simons US Patent 6,337,794, 2002 | 106 | 2002 |
| Optimization of data center room layout to minimize rack inlet air temperature S Bhopte, D Agonafer, R Schmidt, B Sammakia | 103 | 2006 |
| The LVEL turbulence model for conjugate heat transfer at low Reynolds numbers D Agonafer, L Gan-Li, DB Spalding ASME International Mechanical Engineering Congress and Exposition 15533, 23-26, 1996 | 87 | 1996 |
| Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof D Agonafer, RC Chu, MJ Ellsworth Jr, RE Simons US Patent 6,431,260, 2002 | 83 | 2002 |
| Effects of mineral oil immersion cooling on IT equipment reliability and reliability enhancements to data center operations JM Shah, R Eiland, A Siddarth, D Agonafer 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 72 | 2016 |
| Convertible heat exchanger for air or water cooling of electronic circuit components and the like D Agonafer, TM Anderson, GM Chrysler, RC Chu, RE Simons, DT Vader US Patent 5,482,113, 1996 | 60 | 1996 |
| Effect of under floor blockages on data center performance S Bhopte, B Sammakia, R Schmidt, MK Iyengar, D Agonafer Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 54 | 2006 |
| Flow Rate and inlet temperature considerations for direct immersion of a single server in mineral oil R Eiland, J Fernandes, M Vallejo, D Agonafer, V Mulay Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 51 | 2014 |
| A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending L Xu, T Reinikainen, W Ren, BP Wang, Z Han, D Agonafer Microelectronics Reliability 44 (12), 1977-1983, 2004 | 44 | 2004 |
| A comparative study of energy savings in a liquid-cooled server by dynamic control of coolant flow rate at server level P Shahi, S Saini, P Bansode, D Agonafer IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 40 | 2021 |
| Numerical modeling of forced convection heat transfer for modules mounted on circuit boards D Agonafer, DF Moffatt | 40 | 1990 |
| Thermal performance and efficiency of a mineral oil immersed server over varied environmental operating conditions R Eiland, J Edward Fernandes, M Vallejo, A Siddarth, D Agonafer, ... Journal of Electronic Packaging 139 (4), 041005, 2017 | 39 | 2017 |
| Reliability considerations for oil immersion-cooled data centers JM Shah, R Eiland, P Rajmane, A Siddarth, D Agonafer, V Mulay Journal of Electronic Packaging 141 (2), 021007, 2019 | 38 | 2019 |
| Effect of relative humidity, temperature and gaseous and particulate contaminations on information technology equipment reliability P Singh, L Klein, D Agonafer, JM Shah, KD Pujara International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 37 | 2015 |
| Measurement of the thermal performance of a custom-build single-phase immersion cooled server at various high and low temperatures for prolonged time PV Bansode, JM Shah, G Gupta, D Agonafer, H Patel, D Roe, R Tufty Journal of Electronic Packaging 142 (1), 011010, 2020 | 36 | 2020 |
| Design, development, and characterization of a flow control device for dynamic cooling of liquid-cooled servers P Shahi, AP Deshmukh, HY Hurnekar, S Saini, P Bansode, R Kasukurthy, ... Journal of Electronic Packaging 144 (4), 041008, 2022 | 35 | 2022 |
| Thermo-mechanical challenges in stacked packaging D Agonafer, A Kaisare, MM Hossain, Y Lee, BP Dewan-Sandur, ... Heat Transfer Engineering 29 (2), 134-148, 2008 | 35 | 2008 |
