| Low melting temperature Sn-Bi solder: effect of alloying and nanoparticle addition on the microstructural, thermal, interfacial bonding, and mechanical characteristics H Kang, SH Rajendran, JP Jung Metals 11 (2), 364, 2021 | 81 | 2021 |
| Post in-situ reaction ultrasonic treatment for generation of Al–4.4 Cu/TiB2 nanocomposite: A route to enhance the strength of metal matrix nanocomposites J Nampoothiri, RS Harini, SK Nayak, B Raj, KR Ravi Journal of Alloys and Compounds 683, 370-378, 2016 | 63 | 2016 |
| Ultrasonic assisted grain refinement of Al–Mg alloy using in-situ MgAl2O4 particles RS Harini, J Nampoothiri, B Nagasivamuni, B Raj, KR Ravi Materials Letters 145, 328-331, 2015 | 49 | 2015 |
| A review on the fabrication and reliability of three-dimensional integration technologies for microelectronic packaging: Through-Si-via and solder bumping process DH Cho, SM Seo, JB Kim, SH Rajendran, JP Jung Metals 11 (10), 1664, 2021 | 34 | 2021 |
| Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles SH Rajendran, SJ Hwang, JP Jung Metals 10 (10), 1295, 2020 | 28 | 2020 |
| Ultrasonic-assisted dispersion of ZnO nanoparticles to Sn-Bi solder: a study on microstructure, spreading, and mechanical properties SH Rajendran, H Kang, JP Jung Journal of Materials Engineering and Performance 30, 3167-3172, 2021 | 24 | 2021 |
| Synthesis of Al–MgAl2O4 Master Alloy and its Grain Refinement Studies in Pure Aluminium RS Harini, B Raj, KR Ravi Transactions of the Indian Institute of Metals 68, 1059–1063, 2015 | 14 | 2015 |
| Transient liquid phase bonding of copper using Sn coated Cu MWCNT composite powders for power electronics SH Rajendran, DH Jung, WS Jeon, JP Jung Applied Sciences 9 (3), 529, 2019 | 12 | 2019 |
| Active brazing of alumina and copper with multicomponent Ag-Cu-Sn-Zr-Ti filler SH Rajendran, SJ Hwang, JP Jung Metals 11 (3), 509, 2021 | 10 | 2021 |
| Comparative study on the wettability and thermal aging characteristics of SAC 305 nanocomposite solder fabricated by stir-casting and ultrasonic treatment SH Rajendran, DH Cho, JP Jung Materials Today Communications 31, 103814, 2022 | 9 | 2022 |
| Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0 Ag–0.5 Cu solder using 1608 chip capacitor/ENIG joints SH Rajendran, DH Jung, JP Jung Journal of Materials Science: Materials in Electronics 33 (7), 3687-3710, 2022 | 7 | 2022 |
| Effect of ZrO2 Nanomaterials on Wettability and Interfacial Characteristics of Al-19Cu-11Si-2Sn Filler Metal for Low Temperature Al to Cu Dissimilar Brazing DH Jung, SH Rajendran, JP Jung Nanomaterials 8 (10), 784, 2018 | 6 | 2018 |
| Effect of 0D and 1D ZnO nano additive reinforced Sn-3.0 Ag-0.5 Cu solder paste on InGaN LED chip/ENIG joints SH Rajendran, SM Seo, JP Jung Materials Today Communications 35, 105795, 2023 | 4 | 2023 |
| Joining Si3N4 ceramic to Invar using Mo mesh and Cu foil interlayer SH Rajendran, GA Lee, JY Park, YS Kang, JP Jung Materials Chemistry and Physics 313, 128732, 2024 | 2 | 2024 |
| Wettability Evaluation by Wetting Balance Test and Wetting Characteristics of Solders WS Jeon, SH Rajendran, JP Jung Journal of the Microelectronics and Packaging Society 26 (3), 1-6, 2019 | 2 | 2019 |
| Ultrasonic dispersion of nanocomposite solder for microelectronic packaging SH Rajendran, H Kang, SM Seo, JP Jung 17th International Microsystems, Packaging, Assembly and Circuits Technology …, 2022 | 1 | 2022 |
| Recent Advances in High Entropy Alloy Fillers for Brazing Similar and Dissimilar Materials: A Review F Khan, SH Rajendran, JP Jung Metals and Materials International 30 (5), 1145-1169, 2024 | | 2024 |
| Eutectic Bonding in Sequential Bi and Sn Layers for Low-Temperature Interconnections SH Rajendran, JP Jung, CH Jung, SM Seo 2024 International Conference on Electronics Packaging (ICEP), 277-278, 2024 | | 2024 |
| Microstructure and Mechanical Properties of Type 8 Solder Paste for Mini-LED Assembly Using Laser-Assisted Bonding JH Ku, SH Rajendran, JP Jung 2024 International Conference on Electronics Packaging (ICEP), 309-310, 2024 | | 2024 |
| Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding SH Rajendran, JH Ku, J Kang, JP Jung Materials Today Communications 38, 108250, 2024 | | 2024 |
Ravi K RAssociate Professor, Indian Institute of Technology在 iitj.ac.in 的电子邮件经过验证
