关注
Professor Robert Kay
标题
引用次数
引用次数
年份
Nanosecond laser textured superhydrophobic metallic surfaces and their chemical sensing applications
DV Ta, A Dunn, TJ Wasley, RW Kay, J Stringer, PJ Smith, C Connaughton, ...
Applied Surface Science 357, 248-254, 2015
3782015
A review of aerosol jet printing—a non-traditional hybrid process for micro-manufacturing
NJ Wilkinson, MAA Smith, RW Kay, RA Harris
The International Journal of Advanced Manufacturing Technology 105, 4599-4619, 2019
3702019
Laser textured superhydrophobic surfaces and their applications for homogeneous spot deposition
A Dunn, TJ Wasley, J Li, RW Kay, J Stringer, PJ Smith, E Esenturk, ...
Applied Surface Science 365, 153-159, 2016
3142016
Baricitinib in patients admitted to hospital with COVID-19 (RECOVERY): a randomised, controlled, open-label, platform trial and updated meta-analysis
O Abani, A Abbas, F Abbas, J Abbas, K Abbas, M Abbas, S Abbasi, ...
The Lancet 400 (10349), 359-368, 2022
2362022
Laser textured surface gradients
A Dunn, TJ Wasley, J Li, RW Kay, J Stringer, PJ Smith, E Esenturk, ...
Applied Surface Science 371, 583-589, 2016
1102016
Multifunctional metal matrix composites with embedded printed electrical materials fabricated by ultrasonic additive manufacturing
J Li, T Monaghan, TT Nguyen, RW Kay, RJ Friel, RA Harris
Composites Part B: Engineering 113, 342-354, 2017
1022017
Hybrid additive manufacturing of 3D electronic systems
J Li, T Wasley, TT Nguyen, VD Ta, JD Shephard, J Stringer, P Smith, ...
Journal of Micromechanics and Microengineering 26 (10), 105005, 2016
702016
A review of stencil printing for microelectronic packaging
R Kay, M Desmulliez
Soldering & Surface Mount Technology 24 (1), 38-50, 2012
612012
A rapid photopatterning method for selective plating of 2D and 3D microcircuitry on polyetherimide
J Marques‐Hueso, TDA Jones, DE Watson, A Ryspayeva, MN Esfahani, ...
Advanced Functional Materials 28 (6), 1704451, 2018
462018
Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality
J Stringer, TM Althagathi, CCW Tse, VD Ta, JD Shephard, E Esenturk, ...
EDP Open, 2016
462016
Dynamically controlled deposition of colloidal nanoparticle suspension in evaporating drops using laser radiation
VD Ta, RM Carter, E Esenturk, C Connaughton, TJ Wasley, J Li, RW Kay, ...
Soft Matter 12 (20), 4530-4536, 2016
432016
Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process
RW Kay, S Stoyanov, GP Glinski, C Bailey, MPY Desmulliez
IEEE Transactions on Components and packaging technologies 30 (1), 129-136, 2007
422007
Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications
GJ Jackson, MW Hendriksen, RW Kay, M Desmulliez, RK Durairaj, ...
Soldering & Surface Mount Technology 17 (1), 24-32, 2005
312005
Additively manufactured heterogeneous substrates for three‐dimensional control of local permittivity
J Tribe, WG Whittow, RW Kay, JC Vardaxoglou
Electronics Letters 50 (10), 745-746, 2014
302014
A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications
A Ryspayeva, TDA Jones, MN Esfahani, MP Shuttleworth, RA Harris, ...
Microelectronic Engineering 209, 35-40, 2019
292019
Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
S Costello, N Strusevich, D Flynn, RW Kay, MK Patel, C Bailey, D Price, ...
Microsystem technologies 19, 783-790, 2013
292013
Electrohydrodynamic and aerosol jet printing for the copatterning of polydimethylsiloxane and graphene platelet inks
NJ Wilkinson, RW Kay, RA Harris
Advanced Materials Technologies 5 (6), 2000148, 2020
252020
Optimization and characterization of drop-on-demand inkjet printing process for platinum organometallic inks
G Cummins, R Kay, J Terry, MPY Desmulliez, AJ Walton
2011 IEEE 13th Electronics Packaging Technology Conference, 256-261, 2011
252011
Selective electroless copper deposition by using photolithographic polymer/Ag nanocomposite
A Ryspayeva, TDA Jones, MN Esfahani, MP Shuttleworth, RA Harris, ...
IEEE Transactions on Electron Devices 66 (4), 1843-1848, 2019
242019
Stencil printing technology for wafer level bumping at sub-100 micron pitch using Pb-free alloys
RW Kay, E De Gourcuff, MPY Desmulliez, GJ Jackson, HAH Steen, C Liu, ...
Proceedings Electronic Components and Technology, 2005. ECTC'05., 848-854, 2005
232005
系统目前无法执行此操作,请稍后再试。
文章 1–20