| Packaging substrate having through-holed interposer embedded therein and fabrication method thereof YS Hu, D Hu, TJ Tseng US Patent 8,269,337, 2012 | 121 | 2012 |
| System for protection of drive circuits formed on a substrate of a liquid crystal display D Hu, SN Lee, J Lan US Patent 5,517,344, 1996 | 93 | 1996 |
| System-in-package and manufacturing method of the same D Hu, CH Yu US Patent 7,884,461, 2011 | 66 | 2011 |
| Packaging substrate having embedded interposer and fabrication method thereof D Hu, JHS Lau US Patent 9,385,056, 2016 | 62 | 2016 |
| Composite bump bonding SM Chang, J Jou, YC Lee, D Hu US Patent App. 10/061,023, 2002 | 61 | 2002 |
| Fabrication method of packaging substrate having through-holed interposer embedded therein YS Hu, D Hu, TJ Tseng US Patent 8,709,865, 2014 | 51 | 2014 |
| Redundant scheme for LCD display with integrated data driving circuit SN Lee, HM Tang, D Hu US Patent 5,555,001, 1996 | 45 | 1996 |
| Package substrate D Hu US Patent 10,373,918, 2019 | 39 | 2019 |
| Packaging substrate having embedded through-via interposer and method of fabricating the same D Hu, TJ Tseng US Patent 8,946,564, 2015 | 39 | 2015 |
| Stacked package-on-package memory devices D Hu US Patent 9,685,429, 2017 | 35 | 2017 |
| Packaging carrier and manufacturing method thereof and chip package structure MC Chen, D Hu US Patent 9,374,896, 2016 | 30 | 2016 |
| Method for circuits inspection and method of the same YS Hu, D Hu US Patent 7,534,632, 2009 | 28 | 2009 |
| Humidity effect on polyimide film adhesion DC Hu, HC Chen Journal of materials science 27, 5262-5268, 1992 | 28 | 1992 |
| Package substrate with lateral communication circuitry D Hu US Patent 9,543,249, 2017 | 27 | 2017 |
| Thin film RDL for nanochip package D Hu US Patent 9,263,373, 2016 | 24 | 2016 |
| Composite bump bonding SM Chang, J Jou, YC Lee, D Hu US Patent 6,365,500, 2002 | 24 | 2002 |
| LCD having trench formed on the substrate (s) to stop sealing material flowing to display areas D Hu, HM Lee, TK Wu, SN Lee, SH Lin, CC Tsai, HC Kuo, CJ Chen US Patent 6,018,380, 2000 | 24 | 2000 |
| Package structure having embedded bonding film and manufacturing method thereof D Hu US Patent 10,037,946, 2018 | 23 | 2018 |
| Trace structure and method for fabricating the same JH Chang, CC Lee, D Hu US Patent App. 11/761,381, 2008 | 23 | 2008 |
| Package substrate having photo-sensitive dielectric layer and method of fabricating the same YH Chen, WC Lo, D Hu, C Hsieh US Patent 9,485,874, 2016 | 21 | 2016 |
