关注
tuck-boon chan
tuck-boon chan
在 qti.qualcomm.com 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
OpenROAD: Toward a self-driving, open-source digital layout implementation tool chain
T Ajayi, D Blaauw
Proceedings of Government Microcircuit Applications and Critical Technology …, 2019
882019
On the efficacy of NBTI mitigation techniques
TB Chan, J Sartori, P Gupta, R Kumar
2011 Design, Automation & Test in Europe, 1-6, 2011
842011
DDRO: A novel performance monitoring methodology based on design-dependent ring oscillators
TB Chan, P Gupta, AB Kahng, L Lai
Thirteenth International Symposium on Quality Electronic Design (ISQED), 633-640, 2012
552012
Synthesis and analysis of design-dependent ring oscillator (DDRO) performance monitors
TB Chan, P Gupta, AB Kahng, L Lai
IEEE transactions on very large scale integration (VLSI) systems 22 (10 …, 2013
332013
LTCC spiral inductor synthesis and optimization with measurement verification
HC Lu, TB Chan, CCP Chen, CM Liu, HJ Hsing, PS Huang
IEEE transactions on advanced packaging 33 (1), 160-168, 2009
262009
OCV-aware top-level clock tree optimization
TB Chan, K Han, AB Kahng, JG Lee, S Nath
Proceedings of the 24th edition of the great lakes symposium on VLSI, 33-38, 2014
252014
Electrical modeling of lithographic imperfections
TB Chan, RS Ghaida, P Gupta
2010 23rd International Conference on VLSI Design, 423-428, 2010
232010
Tunable sensors for process-aware voltage scaling
TB Chan, AB Kahng
Proceedings of the International Conference on Computer-Aided Design, 7-14, 2012
222012
Impact of adaptive voltage scaling on aging-aware signoff
TB Chan, WTJ Chan, AB Kahng
2013 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2013
202013
IC layout adjustment method and tool for improving dielectric reliability at interconnects
AB Kahng, TB Chan
US Patent 9,922,161, 2018
192018
LTCC layer-to-layer misalignment-tolerant coupled inductors and their application to bandpass filter and helical inductors
HC Lu, TW Chao, YL Chang, TB Chan, YT Chou
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011
172011
On aging-aware signoff for circuits with adaptive voltage scaling
TB Chan, WTJ Chan, AB Kahng
IEEE Transactions on Circuits and Systems I: Regular Papers 61 (10), 2920-2930, 2014
162014
Optimization of overdrive signoff
TB Chan, AB Kahng, J Li, S Nath
2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC), 344-349, 2013
152013
Design dependent process monitoring for back-end manufacturing cost reduction
TB Chan, A Pant, L Cheng, P Gupta
2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 116-122, 2010
152010
Redcooper: Hardware sensor enabled variability software testbed for lifetime energy constrained application
Y Agarwal, A Bishop, TB Chan, M Fotjik, P Gupta, A Kahng, L Lai, P Martin, ...
142014
On electrical modeling of imperfect diffusion patterning
TB Chan, P Gupta
2010 23rd International Conference on VLSI Design, 224-229, 2010
132010
Nolo: A no-loop, predictive useful skew methodology for improved timing in ic implementation
TB Chan, AB Kahng, J Li
Fifteenth International Symposium on Quality Electronic Design, 504-509, 2014
122014
LTCC spiral inductor modeling, synthesis, and optimization
TB Chan, HC Lu, JK Zeng, CCP Chen
2008 Asia and South Pacific Design Automation Conference, 768-771, 2008
122008
Revisiting inherent noise floors for interconnect prediction
TB Chan, AB Kahng, M Woo
Proceedings of the Workshop on System-Level Interconnect: Problems and …, 2020
112020
Measurement and optimization of electrical process window
AA Kagalwalla, 3 Puneet
Journal of Micro/Nanolithography, MEMS and MOEMS 10 (1), 013014-013014-14, 2011
11*2011
系统目前无法执行此操作,请稍后再试。
文章 1–20