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Ezekiel Y Hsieh
Ezekiel Y Hsieh
在 illinois.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
Kirigami-inspired strain-insensitive sensors based on atomically-thin materials
K Yong, S De, EY Hsieh, J Leem, NR Aluru, SW Nam
Materials Today 34, 58-65, 2020
862020
Strain Engineering of Low‐Dimensional Materials for Emerging Quantum Phenomena and Functionalities
JM Kim, MF Haque, EY Hsieh, SM Nahid, I Zarin, KY Jeong, JP So, ...
Advanced Materials, 2107362, 2022
482022
Multiaxially-stretchable kirigami-patterned mesh design for graphene sensor devices
HC Lee, EY Hsieh, K Yong, SW Nam
Nano Research 13 (5), 1406-1412, 2020
462020
Plasmonic sensors based on graphene and graphene hybrid materials
Z Zhang, Y Lee, MF Haque, J Leem, EY Hsieh, SW Nam
Nano Convergence 9 (1), 1-24, 2022
422022
Heterogeneous deformation of two-dimensional materials for emerging functionalities
JM Kim, C Cho, EY Hsieh, SW Nam
Journal of materials research 35 (11), 1369-1385, 2020
162020
Effectiveness of end-of-queue warning systems and portable rumble strips on lane closure crashes
EY Hsieh, GL Ullman, G Pesti, RE Brydia
Journal of Transportation Engineering, Part A: Systems 143 (11), 04017053, 2017
52017
Kirigami-inspired strain-insensitive sensors
SW Nam, Y Keong, S De, NR Aluru, LEE Hyochan, EY HSIEH
US Patent App. 17/010,202, 2021
22021
Biaxially-Stretchable Kirigami-Patterned Mesh Structures for Motion Artifact-Free Wearable Devices
HC Lee, EY Hsieh, SW Nam
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-3, 2021
2021
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