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Zhekun Peng
Zhekun Peng
在 mst.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
MXene–graphene field-effect transistor sensing of influenza virus and SARS-CoV-2
Y Li, Z Peng, NJ Holl, MR Hassan, JM Pappas, C Wei, OH Izadi, Y Wang, ...
ACS omega 6 (10), 6643-6653, 2021
1232021
Trend analysis of dissipated electrostatic discharge energy in touchscreen displays
Z Peng, S Marathe, H Rezaei, G Maghlakelidze, D Pommerenke, ...
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
42020
Characterization and modeling of commercial ICs for system-efficient ESD design
Z Peng, Y Xu, M Yea, S Bub, S Holland, DH Kim, D Pommerenke, ...
IEEE Transactions on Electromagnetic Compatibility 64 (6), 1802-1811, 2022
32022
Experimental characterization and methodology for full-wave modeling of ESD to displays
H Rezaei, Z Peng, S Marathe, D Pommerenke, CW Lam, A Foudazi, ...
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
32020
Radiated Emission Tests for High-frequency Router Systems in Class A: Discussion and Improvement
W Zhang, Z Peng, X Wang, DH Kim, J Drewniak
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 119-124, 2021
22021
Wearable MXene‐Graphene Sensing of Influenza and SARS‐CoV‐2 Virus in Air and Breath: From Lab to Clinic
Y Li, Z Peng, J Li, C Wei, S Liu, W Hao, H Cheng, C Burton, Y Wang, ...
Advanced Materials Technologies 9 (3), 2201787, 2024
12024
Characterization and Modeling of Sparkless Discharge to a Touch Screen Display
J Zhou, CW Lam, Z Peng, D Beetner, D Pommerenke
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023
12023
On-chip ESD protection structure modeling methodology
Z Peng, OH Izadi, L Shen, M Yea, P Wei, J Meiguni, A Foudazi, S Marathe, ...
12022
Dust Figure Guided Modeling of Corona Discharge on Touchscreen Surface
Z Peng, J Zhou, D Kostka, D Pommerenke, D Beetner
2024 IEEE Joint International Symposium on Electromagnetic Compatibility …, 2024
2024
Reconfigurable Intelligent Surface (RIS) Design for 5G n260 Frequency Band
R Yazdani, MK Mathew, Z Peng, DH Kim
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023
2023
Analysis on Extraction of Potential Radiated Emission Limit line for Data Center Equipment from 10 GHz to 40 GHz
Z Peng, W Zhang, JH Kwon, DH Kim
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023
2023
Analysis of Electro-static Discharge to Through-silicon Via
Z Peng, W Zhang, DH Kim
DesignCon, 2021
2021
Voltage-dependency Effect of Through-silicon Vias on the Power Distribution Network
Z Wei, W Xu, P Zhekun, P Bo, K DongHyun
DesignCon, 2021
2021
Commercial USB IC Soft-Failure Sensitivity Measurement Method and Trend Analysis
R Hua, O Hoseini, Z Peng, H Shumiya, S Konno, K Araki, D Pommerenke, ...
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
2020
Editorial Introduction to the Special Issue on Electrostatic Discharge and Immunity—From IC to System.........................
MD Ker, D Pommerenke, ZH Jiang, Z Peng, Y Xu, M Yea, S Bub, ...
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