| Effect of inclusion size on the nucleation of acicular ferrite in welds TK Lee, K HJ ISIJ international 40 (12), 1260-1268, 2000 | 291 | 2000 |
| Fundamentals of lead-free solder interconnect technology TK Lee, TR Bieler, C Kim, H Ma Springer (US) chapter 1, 1-20, 2015 | 146 | 2015 |
| The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints TR Bieler, B Zhou, L Blair, A Zamiri, P Darbandi, F Pourboghrat, TK Lee, ... Journal of Electronic Materials 41, 283-301, 2012 | 127 | 2012 |
| Impact of isothermal aging on long-term reliability of fine-pitch ball grid array packages with Sn-Ag-Cu solder interconnects: Surface finish effects TK Lee, H Ma, KC Liu, J Xue Journal of Electronic Materials 39, 2564-2573, 2010 | 101 | 2010 |
| Sn-Ag-Cu solder joint microstructure and orientation evolution as a function of position and thermal cycles in ball grid arrays using orientation imaging microscopy TK Lee, B Zhou, L Blair, KC Liu, TR Bieler Journal of electronic materials 39, 2588-2597, 2010 | 86 | 2010 |
| Crack development in a low-stress PBGA package due to continuous recrystallization leading to formation of orientations with [001] parallel to the interface B Zhou, TR Bieler, TK Lee, KC Liu Journal of electronic materials 39, 2669-2679, 2010 | 72 | 2010 |
| Crystal plasticity finite-element analysis of deformation behavior in multiple-grained lead-free solder joints P Darbandi, TR Bieler, F Pourboghrat, T Lee Journal of electronic materials 42, 201-214, 2013 | 65 | 2013 |
| Methodology for analyzing slip behavior in ball grid array lead-free solder joints after simple shear B Zhou, TR Bieler, TK Lee, KC Liu Journal of electronic materials 38, 2702-2711, 2009 | 64 | 2009 |
| The corrosion of stainless steel made by additive manufacturing: A review G Ko, W Kim, K Kwon, TK Lee Metals 11 (3), 516, 2021 | 62 | 2021 |
| Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish CF Tseng, TK Lee, G Ramakrishna, KC Liu, JG Duh Materials Letters 65 (21-22), 3216-3218, 2011 | 62 | 2011 |
| Microstructure and orientation evolution of the Sn phase as a function of position in ball grid arrays in Sn-Ag-Cu solder joints TK Lee, KC Liu, TR Bieler Journal of electronic materials 38, 2685-2693, 2009 | 49 | 2009 |
| Slip, crystal orientation, and damage evolution during thermal cycling in high-strain wafer-level chip-scale packages B Zhou, Q Zhou, TR Bieler, T Lee Journal of Electronic Materials 44, 895-908, 2015 | 44 | 2015 |
| J. Electron. Mater. TK Lee, B Zhou, T Bieler, KC Liu J. Electron. Mater 34 (1), 1-11, 2005 | 42 | 2005 |
| Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures CY Yu, TK Lee, M Tsai, KC Liu, JG Duh Journal of electronic materials 39, 2544-2552, 2010 | 41 | 2010 |
| The effect of cooling rate on grain orientation and misorientation microstructure of SAC105 solder joints before and after impact drop tests P Darbandi, TR Bieler, F Pourboghrat, T Lee Journal of electronic materials 43, 2521-2529, 2014 | 40 | 2014 |
| Impact of 5% NaCl salt spray pretreatment on the long-term reliability of wafer-level packages with Sn-Pb and Sn-Ag-Cu solder interconnects B Liu, TK Lee, KC Liu Journal of electronic materials 40, 2111-2118, 2011 | 37 | 2011 |
| The influence of an imposed current on the creep of Sn-Ag-Cu solder C Kinney, JW Morris, TK Lee, KC Liu, J Xue, D Towne Journal of Electronic Materials 38, 221-226, 2009 | 37 | 2009 |
| Crystal plasticity finite element study of deformation behavior in commonly observed microstructures in lead free solder joints P Darbandi, T Lee, TR Bieler, F Pourboghrat Computational materials science 85, 236-243, 2014 | 35 | 2014 |
| Characterization of recrystallization and microstructure evolution in lead-free solder joints using EBSD and 3D-XRD B Zhou, TR Bieler, TK Lee, W Liu Journal of electronic materials 42, 319-331, 2013 | 35 | 2013 |
| Improved strength of boron-doped Sn-1.0 Ag-0.5 Cu solder joints under aging conditions H Choi, TK Lee, Y Kim, H Kwon, CF Tseng, JG Duh, H Choe Intermetallics 20 (1), 155-159, 2012 | 32 | 2012 |
Thomas R. BielerMichigan State University在 egr.msu.edu 的电子邮件经过验证
