| Reaction synthesis and microstructures of NiAl/Ni micro-laminated composites HY Kim, DS Chung, SH Hong Materials Science and Engineering: A 396 (1-2), 376-384, 2005 | 82 | 2005 |
| Bilayer thickness effects on nanoindentation behavior of Ag/Ni multilayers BC Kang, HY Kim, OY Kwon, SH Hong Scripta Materialia 57 (8), 703-706, 2007 | 65 | 2007 |
| Intermixing criteria for reaction synthesis of Ni/Al multilayered microfoils HY Kim, DS Chung, SH Hong Scripta Materialia 54 (9), 1715-1719, 2006 | 35 | 2006 |
| Creep behavior of undoped and La–Nb codoped PZT based micro-piezoactuators for micro-optical modulator applications EM Bourim, HY Kim, JS Yang, JW Yang, KS Woo, JH Song, SK Yun Sensors and Actuators A: Physical 155 (2), 290-298, 2009 | 25 | 2009 |
| A novel diffractive micro-optical modulator for mobile display applications SK Yun, JH Song, SD An, IJ Yeo, YJ Choi, YG Lee, HW Park, KB Han, ... MOEMS and Miniaturized Systems VII 6887, 17-27, 2008 | 23 | 2008 |
| Characterization and observation of Cu-Cu Thermo-Compression Bonding using 4-point bending test system JW Kim, KS Kim, HJ Lee, HY Kim, YB Park, SM Hyun Journal of the Microelectronics and Packaging Society 18 (4), 11-18, 2011 | 15 | 2011 |
| Spatial optical modulator (SOM): high-density diffractive laser projection display SK Yun, JH Song, IJ Yeo, YJ Choi, V Yurlov, SD An, HW Park, HS Yang, ... Emerging Liquid Crystal Technologies II 6487, 235-241, 2007 | 15 | 2007 |
| Investigation of integrated reactive multilayer systems for bonding in microsystem technology EM Bourim, IS Kang, HY Kim Micromachines 12 (10), 1272, 2021 | 12 | 2021 |
| Development and characterization of non-evaporable getter thin films with Ru seeding layer for MEMS applications EM Bourim, HY Kim, NK Chung Micromachines 9 (10), 490, 2018 | 12 | 2018 |
| Tensile and fracture properties of NiAl/Ni micro-laminated composites prepared by reaction synthesis HY Kim, DS Chung, M Enoki, SH Hong Journal of materials research 21 (5), 1141-1149, 2006 | 11 | 2006 |
| Wafer-level reliability characterization for wafer-level-packaged microbolometer with ultrasmall array size CM Yang, H Jung, JH Park, HY Kim Microsystem technologies 20 (4), 889-897, 2014 | 10 | 2014 |
| Development of microbolometer with high fill factor and high mechanical stability by shared-anchor structure T Kim, K Kyung, JH Park, YS Kim, SK Lim, K Kim, K Lee, C Welham, ... Infrared Technology and Applications XXXVIII 8353, 454-460, 2012 | 10 | 2012 |
| Magnetostriction and magnetomechanical coupling of grain-aligned Tb0. 33Dy0. 67Fey/epoxy-filled composites OY Kwon, HY Kim, SI Cha, SH Hong Journal of applied physics 97 (11), 2005 | 10 | 2005 |
| Improved hydrogen gas sensing performance of Pd–Ni alloy thin films SB Eadi, JS Oh, C Kim, G Sim, K Kim, HY Kim, JJ Kim, HR Do, S Chu, ... International Journal of Hydrogen Energy 48 (33), 12534-12539, 2023 | 9 | 2023 |
| Magnetic shield integration for a chip-scale atomic clock HG Hong, J Park, TH Kim, HY Kim, SE Park, SB Lee, MS Heo, TY Kwon Applied Physics Express 13 (10), 106504, 2020 | 9 | 2020 |
| Mechanical Robustness of FPA in a-Si microbolometer with fine pitch HY Kim, KM Kim, BI Kim, WS Jang, TH Kim, TY Kang Sensors & Transducers 11, 56, 2011 | 8 | 2011 |
| Thermal characterization of individual pixels in microbolometer image sensors by thermoreflectance microscopy SY Ryu, HY Choi, DU Kim, GH Kim, T Kim, HY Kim, KS Chang JSTS: Journal of Semiconductor Technology and Science 15 (5), 533-538, 2015 | 7 | 2015 |
| The micro pirani gauge with low noise CDS-CTIA for in-situ vacuum monitoring G Kim, C Seok, T Kim, JH Park, H Kim, H Ko JSTS: Journal of Semiconductor Technology and Science 14 (6), 733-740, 2014 | 7 | 2014 |
| Design and characteristics of a-Si-based micro-bolometers with shared-anchor structure in vacuum packaged systems H Jung, TH Kim, G Kim, CM Yang, JH Park, HY Kim Microsystem technologies 20, 899-905, 2014 | 5 | 2014 |
| Broadband enhancement of infrared absorption in microbolometers using Ag nanocrystals JK Hyun, CW Ahn, WC Kim, TH Kim, MS Hyun, WO Lee, HY Kim, JH Park Applied Physics Letters 107 (25), 2015 | 4 | 2015 |
