| Potential induced degradation of solar cells and panels S Pingel, O Frank, M Winkler, S Daryan, T Geipel, H Hoehne, J Berghold 2010 35th IEEE Photovoltaic Specialists Conference, 002817-002822, 2010 | 482 | 2010 |
| Mechanical stability of solar cells within solar panels S Pingel, Y Zemen, O Frank, T Geipel, J Berghold Proc. of 24th EUPVSEC, 3459-3464, 2009 | 106 | 2009 |
| Intermetallic compounds in solar cell interconnections: Microstructure and growth kinetics T Geipel, M Moeller, J Walter, A Kraft, U Eitner Solar Energy Materials and Solar Cells 159, 370-388, 2017 | 56 | 2017 |
| The impact of yield strength of the interconnector on the internal stress of the solar cell within a module Y Zemen, T Prewitz, T Geipel, S Pingel, J Berghold 25th European Photovoltaic Solar Energy Conference and Exhibition, 4073-4078, 2010 | 41 | 2010 |
| Characterization of electrically conductive adhesives U Eitner, T Geipel, SN Holtschke, M Tranitz Energy Procedia 27, 676-679, 2012 | 38 | 2012 |
| Applications of parallel dispensing in PV metallization M Pospischil, T Riebe, A Jimenez, M Kuchler, S Tepner, T Geipel, ... AIP Conference Proceedings 2156 (1), 2019 | 37 | 2019 |
| Initial degradation of industrial silicon solar cells in solar panels S Pingel, D Koshnicharov, O Frank, T Geipel, Y Zemen, B Striner, ... Conference Paper, January, 2010 | 32 | 2010 |
| Letid—a comparison of test methods on module level E Fokuhl, T Naeem, A Schmid, P Gebhardt, T Geipel, D Philipp 36th European PV Solar Energy Conference and Exhibition 36, 816-821, 2019 | 27 | 2019 |
| Optimization of electrically conductive adhesive bonds in photovoltaic modules T Geipel, M Meinert, A Kraft, U Eitner IEEE Journal of Photovoltaics 8 (4), 1074-1081, 2018 | 26 | 2018 |
| Interconnection of silicon heterojunction solar cells by infrared soldering-solder joint analysis and temperature study A De Rose, T Geipel, D Eberlein, A Kraft, M Nowottnick Proceedings of the 36th European Photovoltaic Solar Energy Conference and …, 2019 | 25 | 2019 |
| Performance of shingled solar modules under partial shading N Klasen, D Weisser, T Rößler, DH Neuhaus, A Kraft Progress in Photovoltaics: Research and Applications 30 (4), 325-338, 2022 | 23 | 2022 |
| Low-temperature soldering for the interconnection of silicon heterojunction solar cells A De Rose, D Erath, T Geipel, A Kraft, U Eitner 33rd European Photovoltaic Solar Energy Conference and Exhibition, 710-714, 2017 | 22 | 2017 |
| Reduction of thermomechanical stress using electrically conductive adhesives T Geipel, LC Rendler, M Stompe, U Eitner, L Rissing Energy Procedia 77, 346-355, 2015 | 22 | 2015 |
| A comprehensive study of module layouts for silicon solar cells under partial shading N Klasen, F Lux, J Weber, T Roessler, A Kraft IEEE Journal of Photovoltaics 12 (2), 546-556, 2022 | 21 | 2022 |
| A comprehensive study of intermetallic compounds in solar cell interconnections and their growth kinetics T Geipel, M Moeller, A Kraft, U Eitner Energy Procedia 98, 86-97, 2016 | 21 | 2016 |
| Post-separation processing for silicon heterojunction half solar cells with passivated edges A Münzer, P Baliozian, A Steinmetz, T Geipel, S Pingel, A Richter, ... IEEE Journal of Photovoltaics 11 (6), 1343-1349, 2021 | 19 | 2021 |
| Reliable interconnection of the front side grid fingers using silver-reduced conductive adhesives T Geipel, MZ Huq, U Eitner Energy Procedia 55, 336-341, 2014 | 19 | 2014 |
| Qualification of conductive adhesives for photovoltaic application-accelerated ageing tests LP Bauermann, E Fokuhl, S Stecklum, D Philipp, T Geipel, A Kraft, ... Energy Procedia 124, 554-559, 2017 | 18 | 2017 |
| Modelling and verification of mechanical stress induced by soldering of wires for multi busbar interconnection LC Rendler, J Walter, T Geipel, M Volk, C Ebert, U Eitner Proceedings of the 31st European Photovoltaic Solar Energy Conference and …, 2015 | 14 | 2015 |
| Innovative and gentle interconnection technique for high efficiency c-Si solar cells and cost-of-ownership-analysis (COO) Y Zemen, H Trommler, K Wolter, T Geipel, J Berghold, S Pingel, ... Proc. EU PVSEC, 3125-3132, 2011 | 14 | 2011 |
