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Heechang Shin
Heechang Shin
在 yonsei.ac.kr 的电子邮件经过验证
标题
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Stretchable electroluminescent display enabled by graphene-based hybrid electrode
H Shin, BK Sharma, SW Lee, JB Lee, M Choi, L Hu, C Park, JH Choi, ...
ACS applied materials & interfaces 11 (15), 14222-14228, 2019
802019
Impact of 2D–3D heterointerface on remote epitaxial interaction through graphene
H Kim, K Lu, Y Liu, HS Kum, KS Kim, K Qiao, SH Bae, S Lee, YJ Ji, ...
ACS nano 15 (6), 10587-10596, 2021
762021
Graphene nanopattern as a universal epitaxy platform for single-crystal membrane production and defect reduction
H Kim, S Lee, J Shin, M Zhu, M Akl, K Lu, NM Han, Y Baek, CS Chang, ...
Nature Nanotechnology 17 (10), 1054-1059, 2022
472022
Epitaxial growth of wafer-scale molybdenum disulfide/graphene heterostructures by metal–organic vapor-phase epitaxy and their application in photodetectors
AT Hoang, AK Katiyar, H Shin, N Mishra, S Forti, C Coletti, JH Ahn
ACS Applied Materials & Interfaces 12 (39), 44335-44344, 2020
392020
Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions
JH Kang, H Shin, KS Kim, MK Song, D Lee, Y Meng, C Choi, JM Suh, ...
Nature materials 22 (12), 1470-1477, 2023
352023
3D motion tracking display enabled by magneto-interactive electroluminescence
SW Lee, S Baek, SW Park, M Koo, EH Kim, S Lee, W Jin, H Kang, C Park, ...
Nature communications 11 (1), 6072, 2020
352020
High energy density in artificial heterostructures through relaxation time modulation
S Han, JS Kim, E Park, Y Meng, Z Xu, AC Foucher, GY Jung, I Roh, S Lee, ...
Science 384 (6693), 312-317, 2024
32024
Nonconventional Strain Engineering for Uniform Biaxial Tensile Strain in MoS2 Thin Film Transistors
H Shin, AK Katiyar, AT Hoang, SM Yun, BJ Kim, G Lee, Y Kim, JD Lee, ...
ACS nano 18 (5), 4414-4423, 2024
32024
Heterogeneous integration of high-k complex-oxide gate dielectrics on wide band-gap high-electron-mobility transistors
J Ji, JY Yang, S Lee, S Kim, MJ Yeom, G Lee, H Shin, SH Bae, JH Ahn, ...
Communications Engineering 3 (1), 15, 2024
12024
Vertical hetero-integration of 2D-materials-based integrated circuits for artificial intelligence
JH Kang, H Shin, KS Kim, MK Song
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