关注
Tarek Gebrael
Tarek Gebrael
Packaging R&D Engineer
在 intel.com 的电子邮件经过验证
标题
引用次数
引用次数
年份
Water immersion cooling of high power density electronics
P Birbarah, T Gebrael, T Foulkes, A Stillwell, A Moore, ...
International Journal of Heat and Mass Transfer 147, 118918, 2020
1272020
Downscaling the 2D Bénard convection equations using continuous data assimilation
MU Altaf, ES Titi, T Gebrael, OM Knio, L Zhao, MF McCabe, I Hoteit
Computational Geosciences 21, 393-410, 2017
922017
High-efficiency cooling via the monolithic integration of copper on electronic devices
T Gebrael, J Li, AR Gamboa, J Ma, J Schaadt, L Horowitz, ...
Nature Electronics 5 (6), 394-402, 2022
292022
An interleaved 6-level gan bidirectional converter with an active energy buffer for level ii electric vehicle charging
D Chou, Z Liao, K Fernandez, T Gebrael, G Popovic, R Mahony, ...
2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 1203-1208, 2021
122021
A bidirectional liquid-cooled gan-based ac/dc flying capacitor multi-level converter with integrated startup and additively manufactured cold-plate for electric vehicle charging
K Fernandez, R Iyer, T Ge, J Zou, D Chou, Z Liao, V Agarwal, T Gebrael, ...
2022 IEEE Applied Power Electronics Conference and Exposition (APEC), 548-554, 2022
102022
Self sustained thermally induced gas-damped oscillations of bimetal cantilevers with application to the design of a new pyroelectric micro energy harvester
T Gebrael, A Kanj, D Farhat, M Shehadeh, I Lakkis
Journal of Physics D: Applied Physics 53 (19), 195501, 2020
52020
Hfe7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
AC Iradukunda, D Huitink, K Kayijuka, T Gebrael, N Miljkovic
Journal of Electronic Packaging 145 (1), 011105, 2023
42023
Near field condensation
X Yan, F Chen, C Zhao, Y Qin, X Wang, KF Rabbi, MJ Hoque, H Zhao, J Li, ...
32020
Recent advances in structured surface enhanced condensation heat transfer
H Cha, S Sett, P Birbarah, T Gebrael, J Oh, N Miljkovic
Nanoscale Energy Transport: Emerging phenomena, methods and applications, 13 …, 2020
22020
Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules
AC Iradukunda, D Huitink, T Gebrael, N Miljkovic
International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021
12021
Interference Lithography‐Based Fabrication of 3D Metallic Mesostructures on Reflective Substrates using Electrodeposition‐Compatible Anti‐Reflection Coatings for Power …
G Singhal, S Dewanjee, G Bae, Y Ham, DJ Lohan, KW Lan, J Li, ...
Advanced Electronic Materials, 2300827, 2024
2024
Immersion cooling with water-based fluid using nano-structured coating
N Miljkovic, T Foulkes, P Birbarah, T Gebrael, A Stillwell, ...
US Patent App. 18/138,566, 2023
2023
Immersion cooling with water-based fluid using nano-structured coating
N Miljkovic, T Foulkes, P Birbarah, T Gebrael, A Stillwell, ...
US Patent 11,692,271, 2023
2023
Modeling and design of monolithically coated thermal components
T Gebrael, AR Gamboa, A Joseph, R Pilawa-Podgurski, N Miljkovic
International Journal of Heat and Mass Transfer 205, 123885, 2023
2023
Thermal coating of power electronics boards for thermal management
T Gebrael, AR Gamboa, LI Jiaqi, N Miljkovic, S Aflatounian
US Patent App. 17/953,744, 2023
2023
Immersion cooling and monolithic packaging for the thermal management of high-power density electronics
T Gebrael
2022
Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics
AC Iradukunda, D Huitink, T Gebrael, N Miljkovic
International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022
2022
When Thunder Roars, Go Indoors!
T Gebrael
2021
系统目前无法执行此操作,请稍后再试。
文章 1–18