Adipose-on-a-chip: a dynamic microphysiological in vitro model of the human adipose for immune-metabolic analysis in type II diabetes Y Liu, P Kongsuphol, SY Chiam, QX Zhang, SBN Gourikutty, S Saha, ... Lab on a Chip 19 (2), 241-253, 2019 | 57 | 2019 |
Microfluidic platform for negative enrichment of circulating tumor cells BNG Sajay, CP Chang, H Ahmad, P Khuntontong, CC Wong, Z Wang, ... Biomedical microdevices 16, 537-548, 2014 | 57 | 2014 |
Microfluidic immunomagnetic cell separation from whole blood SBN Gourikutty, CP Chang, PD Puiu Journal of Chromatography B 1011, 77-88, 2016 | 52 | 2016 |
In vitro micro-physiological model of the inflamed human adipose tissue for immune-metabolic analysis in type II diabetes P Kongsuphol, S Gupta, Y Liu, S Bhuvanendran Nair Gourikutty, ... Scientific reports 9 (1), 4887, 2019 | 39 | 2019 |
An integrated on-chip platform for negative enrichment of tumour cells SBN Gourikutty, CP Chang, DP Poenar Journal of Chromatography B 1028, 153-164, 2016 | 27 | 2016 |
Human adipocyte differentiation and characterization in a perfusion-based cell culture device Y Liu, P Kongsuphol, SBN Gourikutty, Q Ramadan Biomedical microdevices 19, 1-10, 2017 | 20 | 2017 |
Towards an optimal and unbiased approach for tumor cell isolation BNG Sajay, CP Chang, H Ahmad, WC Chung, PD Puiu, ARA Rahman Biomedical microdevices 15, 699-709, 2013 | 20 | 2013 |
A novel packaging platform for high-performance optical engines in hyperscale data center applications SBN Gourikutty, MC Jong, CV Kanna, DSW Ho, SW Wei, SLP Siang, J Wu, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 422-427, 2022 | 15 | 2022 |
Defect localization in through-Si-interposer based 2.5 D ICS SBN Gourikutty, YM Chow, J Alton, RB Umralkar, H Bai, KK Chua, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1180-1185, 2020 | 12 | 2020 |
A heterogeneously integrated Wafer-level processed Co-Packaged optical engine for Hyper-scale data centres SBN Gourikutty, LB Long, SW Wei, MC Jong, DSW Ho, J Wu, TG Lim, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 207-211, 2023 | 11 | 2023 |
Optimization of micro-fabricated porous membranes for intestinal epithelial cell culture and in vitro modeling of the human intestinal barrier BNG Sajay, CS Yin, Q Ramadan Journal of Micromechanics and Microengineering 27 (12), 124004, 2017 | 11 | 2017 |
OOCHIP: compartmentalized microfluidic perfusion system with porous barriers for enhanced cell–cell crosstalk in organ-on-a-chip Q Ramadan, SBN Gourikutty, Q Zhang Micromachines 11 (6), 565, 2020 | 9 | 2020 |
Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers SBN Gourikutty, MC Jong, CV Kanna, DSW Ho, J Wu, R Mandal, N Li, ... 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 37-41, 2021 | 8 | 2021 |
Non-destructive fault isolation in through-silicon interposer based system in package SBN Gourikutty, KK Chua, J Alton, JM Chinq, RB Umralkar, ... 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 281-285, 2020 | 8 | 2020 |
Advanced system in package enabled by wafer level heterogeneous integration of chiplets S Bhattacharya, TG Lim, D Ho, KJ Chui, XW Zhang, MD Rotaru, BG Sajay, ... 2022 International Electron Devices Meeting (IEDM), 3.1. 1-3.1. 4, 2022 | 4 | 2022 |
Temperature detection system for Renal Denervation Catheter application SBN Gourikutty, D Choong, R Lim, MRNB Damalerio, J Oh, Y Kim, I Bae, ... 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 198-202, 2020 | 3 | 2020 |
Optimization of breast tumor cells isolation efficiency and purity by membrane filtration BNG Sajay, L Yuxin, C Chia-Pin, PD Puiu, ARA Rahman International Journal of Biomedical and Biological Engineering 6 (9), 451-454, 2012 | 3 | 2012 |
1.6 Tbps (224 Gbps/λ) Silicon Photonic Engine Fabricated with Advanced Electronic-Photonic FOWLP for Co-Packaged Optics and Linear Drive Applications X Li, SBN Gourikutty, J Wu, TG Lim, P Guo, JC Davies, ESC Koh, LB Long, ... Optical Fiber Communication Conference, Tu3A. 2, 2024 | 1 | 2024 |
Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement W Jiaqi, LT Guan, JTY Liow, SBN Gourikutty 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 664-668, 2023 | 1 | 2023 |
Case studies of accurate fault localization in advanced packages SBN Gourikutty, J Alton, D Yeo, KK Chua, SLS Huang, S Bhattacharya 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 850-855, 2021 | 1 | 2021 |