| Exponential integrators for large systems of differential equations M Hochbruck, C Lubich, H Selhofer SIAM Journal on Scientific Computing 19 (5), 1552-1574, 1998 | 706 | 1998 |
| High-speed ultra-accurate direct C2W bonding B Brandstätter, D Aschenwald, B Auer, N Bilewicz, R Boomsma, C Kröll, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1943-1949, 2020 | 22 | 2020 |
| Large panel size bonder with high performance and high accuracy H Selhofer, A Mayr, H Pristauz 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1492-1497, 2019 | 6 | 2019 |
| Apparatus and method for mounting components on a substrate N Bilewicz, A Mayr, H Pristauz, H Selhofer US Patent 10,973,158, 2021 | 4 | 2021 |
| Introduction to GNU Octave H Selhofer, M Oliver, TL Scofield August, 2008 | 4 | 2008 |
| Thermo compression bonding for large dies under protective atmosphere J Abdilla, U Bayer, R Boomsma, S Bulacher, A Kalss, S Martin, H Meixner, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1277-1288, 2020 | 3 | 2020 |
| Apparatus for mounting components on a substrate N Bilewicz, H Selhofer US Patent 10,288,413, 2019 | 3 | 2019 |
| Apparatus for mounting components on a substrate N Bilewicz, A Mayr, H Pristauz, H Selhofer US Patent 11,924,974, 2024 | | 2024 |
| Apparatus and method for mounting components on a substrate N Bilewicz, A Mayr, H Pristauz, H Selhofer US Patent 11,696,429, 2023 | | 2023 |
| Vorrichtung für die Montage von Bauelementen auf einem Substrat N Bilewicz, H Selhofer | | 2021 |
