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Hao Chen
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引用次数
年份
Stepwise design methodology and heterogeneous integration routine of air-cooled SiC inverter for electric vehicle
Z Zeng, X Zhang, F Blaabjerg, H Chen, T Sun
IEEE transactions on power electronics 35 (4), 3973-3988, 2019
562019
Changes and challenges of photovoltaic inverter with silicon carbide device
Z Zeng, W Shao, H Chen, B Hu, W Chen, H Li, L Ran
Renewable and Sustainable Energy Reviews 78, 624-639, 2017
532017
Design and optimization of SiC MOSFET wire bondless power modules
H Chen, MM Hossain, DG Castillo, X Li, A Wallace, Y Chen, HA Mantooth
2020 IEEE 9th international power electronics and motion control conference …, 2020
332020
High voltage SiC power module optimized for low parasitics and compatible system interface
X Li, Y Chen, Y Wu, H Chen, W Weber, A Nasiri, R Cuzner, Y Zhao, ...
2022 IEEE Applied Power Electronics Conference and Exposition (APEC), 999-1003, 2022
222022
Analyses and experiments of the Schottky contact super barrier rectifier (SSBR)
W Chen, R Liao, Z Zeng, P Zhang, Y Zhong, K Tan, H Chen, B Zhang
IEEE Electron Device Letters 38 (7), 902-905, 2017
222017
Feasibility design of tight integration of low inductance sic power module with microchannel cooler
H Chen, T Wei, Y Chen, X Li, N Li, Q Zhu, S Hazra, Y Zhao, MP Gupta, ...
2022 IEEE Applied power electronics conference and exposition (APEC), 962-965, 2022
182022
EMI mitigation with stacking DBC substrate for high voltage power module
X Li, Y Chen, H Chen, S Chinnaiyan, T Li, R Cuzner, A Nasiri, A Mantooth, ...
2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-7, 2022
142022
SiC 器件在光伏逆变器中的应用与挑战
曾正, 邵伟华, 胡博容, 陈昊, 廖兴林, 陈文锁, 李辉, 冉立
中国电机工程学报 37 (1), 221-232, 2017
142017
A 10 kv sic power module stacked substrate design with patterned middle-layer for partial discharge reduction
X Li, H Chen, R Paul, S Mukherjee, X Du, R Cuzner, X Song, Y Zhao, ...
2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 344-349, 2023
112023
On-off behavior control of SiC MOSFET by gate drive loops
Z Zeng, W Shao, H Chen, B Hu, W Chen, H Li, L Ran, Y Zhang, Q Qiu
112018
Comparative evaluations and failure modes of wire-bonding packaged sic, si, and hybrid power modules
X Li, Z Zeng, H Chen, W Shao, L Ran
2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2018
102018
Multi-level embedded three-dimensional manifold microchannel heat sink of aluminum nitride direct bonded copper for the high-power electronic module
Y Lin, T Wei, WJ Moy, H Chen, MP Gupta, M Degner, M Asheghi, ...
Journal of Electronic Packaging 146 (1), 011006, 2024
82024
基于栅极驱动回路的 SiC MOSFET 开关行为调控
曾正, 邵伟华, 陈昊, 胡博容, 陈文锁, 李辉, 冉立, 张瑜洁, 秋琪
中国电机工程学报 38 (4), 1165-1176, 2018
72018
Electro-thermal limited switching frequency for parallel diodes
X Li, H Jiang, B Hu, H Chen, Z Zeng, L Ran, P Mawby
2018 IEEE Energy Conversion Congress and Exposition (ECCE), 4692-4698, 2018
62018
3.3 kV Low-Inductance Full SiC Power Module
Y Chen, X Du, L Du, X Du, ASMK Hasan, X Li, H Chen, R Paul, ...
2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2634-2640, 2023
52023
Short-circuit evaluation and temperature-dependent model of SiC MOSFET
W Shao, L Ran, Z Zeng, X Li, X Hou, H Chen, H Li
Proc. CSEE 38 (7), 2121-2131, 2018
52018
A novel integrated 1.2 kV double-sided cooled power module
R Paul, R Alizadeh, H Chen, X Li, Y Chen, HA Mantooth
2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 372-377, 2023
42023
SiC, Si, 混合功率模块封装对比评估与失效分析
李晓玲, 曾正, 陈昊, 邵伟华, 胡博容, 冉立
中国电机工程学报 38 (16), 4823-4835, 2018
42018
A 10 kV SiC MOSFET power module with optimized system interface and electric field distribution
X Li, Y Chen, H Chen, R Paul, X Song, HA Mantooth
IEEE Transactions on Power Electronics, 2024
32024
Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler
H Chen, Y Lin, T Wei, X Li, R Paul, R Whitt, X Song, Y Zhao, M Asheghi, ...
2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 366-371, 2023
22023
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