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合著作者
Eric PopPease-Ye Professor of Electrical Eng., Materials Sci., App. Phys., Stanford & SLAC在 stanford.edu 的电子邮件经过验证- Myung-Ho BaeKorea Research Institute of Standards and Science, [email protected]在 kriss.re.kr 的电子邮件经过验证
- Josh EixenbergerAssistant Research Professor, Boise State University在 boisestate.edu 的电子邮件经过验证
- Tony Valayil VargheseResearch Scientist在 u.boisestate.edu 的电子邮件经过验证
- kiyo fujimotoBoise State University在 u.boisestate.edu 的电子邮件经过验证
- Feng XiongAssociate Professor, Department of Electrical and Computer Engineering, University of Pittsburgh在 pitt.edu 的电子邮件经过验证
- Harish SubbaramanOregon State University在 oregonstate.edu 的电子邮件经过验证
- Rashid BashirDean, Grainger College of Engineering, Grainger Distinguished Chair, Dept of Bioengineering,在 illinois.edu 的电子邮件经过验证
- Albert LiaoEmerging Memory Engineer, Micron在 micron.com 的电子邮件经过验证
- Shouvik BanerjeeUniversity of Illinois at Urbana Champaign在 illinois.edu 的电子邮件经过验证
- Joshua D. WoodDirector, Solutions Engineering, Dynatrace在 dynatrace.com 的电子邮件经过验证
- Joseph W. LydingProfessor of Electrical and Computer Engineering, University of Illinois在 illinois.edu 的电子邮件经过验证
- Zhun-Yong OngResearch Scientist, Institute of High Performance Computing, Singapore在 ihpc.a-star.edu.sg 的电子邮件经过验证
- Brian J. JaquesBoise State University在 boisestate.edu 的电子邮件经过验证
- N. AluruMechanical Engineering, Oden Institute, University of Texas at Austin; Previous: UIUC在 utexas.edu 的电子邮件经过验证
- Paul H DavisSurface Science Lab Manager, Boise State University在 boisestate.edu 的电子邮件经过验证
- Jiwook ShimIntel Corporation在 intel.com 的电子邮件经过验证
- Raquel Jean Montenegro-BrownDepartment of Materials Science and Engineering, Boise State University在 boisestate.edu 的电子邮件经过验证
- Feifei LianStanford University在 stanford.edu 的电子邮件经过验证
- Yanliang ZhangAssociate Professor, University of Notre Dame在 nd.edu 的电子邮件经过验证
