| High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature P Lall, D Zhang, V Yadav, D Locker Microelectronics Reliability 62, 4-17, 2016 | 99 | 2016 |
| Effect of Temperature on the High Strain Rate Properties of SAC Leadfree Alloys at Temperatures up to 200° C P Lall, D Zhang, V Yadav, J Suhling, D Locker 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1924-1932, 2016 | 48 | 2016 |
| High strain rate mechanical properties of SAC105 leadfree alloy at high operating temperatures P Lall, V Yadav, D Zhang, J Suhling, S Shantaram Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 40 | 2014 |
| Effect of Prolonged Storage up to 1-Year on the High Strain Rate Properties of SAC Leadfree Alloys at Operating Temperatures up to 200° C P Lall, D Zhang, V Yadav, J Suhling, D Locker 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1219-1230, 2017 | 37 | 2017 |
| Material behavior of SAC305 under high strain rate at high temperature P Lall, D Zhang, V Yadav, J Suhling, S Shantaram Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 31 | 2014 |
| Extreme cold-temperature high-strain rate properties of SAC solder alloys P Lall, V Yadav, V Mehta, J Suhling, K Blecker 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 782-792, 2020 | 26 | 2020 |
| Anand Parameters for Modeling Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature P Lall, V Yadav, J Suhling, D Locker 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 448-459, 2018 | 25 | 2018 |
| High strain rate mechanical behavior of SAC-Q solder P Lall, V Yadav, J Suhling, D Locker 2017 16th IEEE intersociety conference on thermal and thermomechanical …, 2017 | 23 | 2017 |
| Evolution of Anand parameters with elevated temperature aging for SAC leadfree alloys P Lall, V Yadav, J Suhling, D Locker International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 16 | 2020 |
| Evolution of Anand Parameters for SAC-Q Solder Alloy after Prolonged Storage up to 1-Year at High Strain Rate at Very High Operating Temperature P Lall, V Yadav, J Suhling, D Locker 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 16 | 2019 |
| Effect of Prolonged Storage on High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder at High Operating Temperature P Lall, V Yadav, J Suhling, D Locker 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 14 | 2018 |
| Low Temperature High Strain Rate Material Properties for SAC-Q Leadfree Alloys P Lall, V Yadav, J Suhling, D Locker 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 13 | 2020 |
| Viscoplastic constitutive model for high strain rate mechanical properties of SAC-Q leadfree solder after high-temperature prolonged storage P Lall, V Yadav, J Suhling, D Locker International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 13 | 2018 |
| High strain rate stress-strain measurement of SAC105 leadfree alloy at temperatures up to 200° C P Lall, V Yadav, J Suhling, D Locker 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 13 | 2016 |
| A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures P Lall, V Yadav, J Suhling, D Locker International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 13 | 2015 |
| Low-Temperature High Strain Rate Constitutive Behavior of Doped and Undoped SnAgCu Solder Alloys after Prolonged Storage at High Temperature P Lall, V Yadav, V Mehta, J Suhling, D Locker 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 830-841, 2021 | 11 | 2021 |
| Sustained high-temperature vibration reliability of thermally aged leadfree assemblies in automotive environments P Lall, V Yadav, D Locker 2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-18, 2020 | 10 | 2020 |
| Effect of Prolonged Storage Up to 1-Year on Anand Parameters for SAC105 Leadfree Alloys P Lall, V Yadav, J Suhling, D Locker 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 10 | 2019 |
| Effect of Thermal Aging on the Evolution of Anand Parameters for SAC105 Leadfree Alloys Operating at Cold Temperatures down to-55° C P Lall, V Yadav, J Suhling, D Locker 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 8 | 2020 |
| Reliability of leadfree solders in high temperature vibration in automotive environments P Lall, V Yadav, J Suhling, D Locker 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 7 | 2019 |
