| Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics B Madadnia, F Bossuyt, J Vanfleteren The International Journal of Advanced Manufacturing Technology 119 (9), 6649 …, 2022 | 6 | 2022 |
| Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation BMBS Martin Hubmann 1, Mona Bakr, Jonas Groten, Martin Pletz, Jan ... Micromachines 14 (4), 876, 2023 | 2 | 2023 |
| Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion TL Martin Hubmann, Behnam Madadnia, Jonas Groten, Martin Pletz, Jan ... Polymers 14 (23), 5060, 2022 | 2 | 2022 |
| Using non-stretchable structures for component positioning in thermoformed electronics B Madadnia, F Bossuyt, J Vanfleteren Flexible and Printed Electronics 7 (3), 035011, 2022 | 2 | 2022 |
| Innovative component positioning method for thermoformed electronics B Madadnia, F Bossuyt, J Vanfleteren Flexible and Printed Electronics 7 (4), 045006, 2022 | 1 | 2022 |
| A Novel Method for Component Positioning in Thermoformed Electronics B Madadnia, F Bossuyt, J Vanfleteren International Conference on System-Integrated Intelligence, 607-615, 2022 | 1 | 2022 |
| Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics B Madadnia, J Vanfleteren, F Bossuyt Micromachines 14 (12), 2248, 2023 | | 2023 |
| Method for manufacturing a non-flat device by deformation of a flat device laminate BM Frederick Bossuyt, Jan Vanfleteren WO Patent WO2023046682A1, 2023 | | 2023 |
| Design and Technology for Accurate Component Positioning in 3D Thermoformed Electronics B Madadnia Ghent University, 2023 | | 2023 |
| Using Grubler's Criterion theory to position the electronic components in thermoformed electronics B Madadnia, F Bossuyt, J Vanfleteren 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC …, 2022 | | 2022 |
| Reducing out-of-plane deformation of metal interconnects in structural electronics M Behnam, B Frederick, V Jan 2021 23rd European Microelectronics and Packaging Conference & Exhibition …, 2021 | | 2021 |
Frederick BossuytPhD Electrical Engineering在 elis.ugent.be 的电子邮件经过验证
