| On-chip noise sensor for integrated circuit susceptibility investigations S Dhia, A Boyer, B Vrignon, M Deobarro, TV Dinh IEEE transactions on instrumentation and measurement 61 (3), 696-707, 2011 | 46 | 2011 |
| Bonding-wire-geometric-profile-dependent model for mutual coupling between two bonding wires on a glass substrate TV Dinh, J Pagazani, D Lesenechal, D Pasquet, P Descamps, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (1 …, 2014 | 18 | 2014 |
| On-wafer multi-port circuits characterization technique with a two-port VNA S Quintanel, D Pasquet, E Bourdel, C Duperrier, D Lesénéchal, TV Dinh, ... 81st ARFTG Microwave Measurement Conference, 1-4, 2013 | 16 | 2013 |
| Analysis of broadband power combiners and coupled antennas with stochastic load matching in a random field for mm-wave applications S Wane, TV Dinh, D Bajon, D Lesénéchal, P Mattheijssen, J Russer, ... 2017 IEEE MTT-S International Microwave Symposium (IMS), 1173-1176, 2017 | 10 | 2017 |
| Design of Lange Couplers with local ground references using SiGe BiCMOS technology for mm-Wave applications S Wane, L Leyssenne, O Tesson, O Doussin, D Bajon, D Lesénéchal, ... 2015 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 351-354, 2015 | 9 | 2015 |
| 3D antenna patterning for MIMO and phased-array systems: Energy-based built-in-self-test for multiphysics co-design S Wane, JA Russer, TV Dinh, D Bajon, D Lesénéchal, P Corrales, ... 2017 International Symposium on Electromagnetic Compatibility-EMC EUROPE, 1-6, 2017 | 8 | 2017 |
| Correlation Technologies for OTA Testing of Mobile Devices: Power-Density Measurement S Wane, F Ferrero, TV Dinh, D Bajon, L Duvillaret, G Gaborit, ... 2021 IEEE Conference on Antenna Measurements & Applications (CAMA), 235-239, 2021 | 6 | 2021 |
| Modeling and characterization of bond-wire arrays for distributed Chip-Package-PCB Co-design TV Dinh, D Lesénéchal, B Domengès, L Leyssenne, D Pasquet, ... 2015 European Microwave Conference (EuMC), 1022-1025, 2015 | 6 | 2015 |
| Crosstalk phenomena analysis using electromagnetic wave propagation by experimental an numerical simulation methods A Palczyńska, A Wymysłowski, T Bieniek, G Janczyk, D Pasquet, TV Dinh 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014 | 6 | 2014 |
| Correlation technologies for emerging wireless applications S Wane, F Ferrero, TV Dinh, D Bajon, L Duvillaret, G Gaborit, V Huard Electronics 11 (7), 1134, 2022 | 5 | 2022 |
| Combined Thermo-Reflectance and Thin-Film Coating in Near-Field Imaging of Chip-Package-PCB-Antenna Modules for Industrial-Testing and Failure Analysis S Wane, D Kendig, TV Dinh, K Alkhalifeh, AE Cabrera, QH Tran, ... 2023 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems …, 2023 | 4 | 2023 |
| Millimeter-wave beamformer chips with smart-antennas for 5G: Toward holistic RFSOI technology solutions including RF-ADCs S Wane, P Corrales, TV Dinh, M Haider, J Russer, QH Tran, CJ Lin, ... 2019 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems …, 2019 | 4 | 2019 |
| Model of mutual coupling between two bonding wires on glass substrate TV Dinh, D Pasquet, P Descamps, D Lesenechal, J Pagazani, ... 2013 International Semiconductor Conference Dresden-Grenoble (ISCDG), 1-4, 2013 | 4 | 2013 |
| High Resolution Spintronics Probe-Array Technology Solutions for Very Near-Field Scanning S Wane, QH Tran, TV Dinh, F Terki, D Bajon, V Huard, L Nyssens, ... 2021 IEEE Conference on Antenna Measurements & Applications (CAMA), 241-246, 2021 | 3 | 2021 |
| Integration of Lange Couplers in SiGe BiCMOS technology for RF and mm-Wave applications perspectives for distributed Chip-Package-PCB Co-integration S Wane, L Leyssenne, O Tesson, O Doussin, D Bajon, D Lesénéchal, ... 2015 European Microwave Conference (EuMC), 44-47, 2015 | 3 | 2015 |
| A RF tunable Agile filter: from component to system design J Pagazani, G Lissorgues, A Mehdaoui, G Schröpfer, T Vinh-Dinh, ... Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on, 2015 | 3 | 2015 |
| Correlation Technologies for OTA Testing of mmWave Mobile Devices Using Energy Metrics S Wane, TV Dinh, QH Tran, D Bajon, F Ferrero, L Duvillaret, G Gaborit, ... 2022 IEEE Radio and Wireless Symposium (RWS), 68-71, 2022 | 2 | 2022 |
| Chip-Package-PCB Co-Design of Power Combiners in SESUB and WLCSP Technology with Re-Distribution Layers TV Dinh, S Wane, D Lesénéchal, P Descamps, L Leyssenne, D Baion 2018 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 20-23, 2018 | 1 | 2018 |
| Reliability analysis of BiCMOS SiGe: C technology under aggressive conditions for emerging RF and mm-wave applications: proposal of reliability-aware circuit design methodology I Lahbib, S Wane, A Doukkali, D Lesénéchal, TV Dinh, L Leyssenne, ... International Journal of Microwave and Wireless Technologies 10 (5-6), 690-699, 2018 | 1 | 2018 |
| Experimental characterization of packaged switch devices for RF and millimeter-Wave applications TV Dinh, P Descamps, D Pasquet, D Lesénéchal, S Wane 2016 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 47-50, 2016 | 1 | 2016 |
Johannes RusserTechnische Universität München在 tum.de 的电子邮件经过验证
