| Printed electronics for extreme high temperature environments M Alhendi, F Alshatnawi, EM Abbara, R Sivasubramony, G Khinda, ... Additive Manufacturing 54, 102709, 2022 | 40 | 2022 |
| Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink AR Gharaibeh, YM Manaserh, MI Tradat, FW AlShatnawi, SN Schiffres, ... Journal of Electronic Packaging 144 (3), 031017, 2022 | 14 | 2022 |
| High Temperature Die Interconnection Approaches F Alshatnawi, M Alhendi, RA Al-Haidari, RS Sivasubramony, EM Abbara, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1539-1545, 2022 | 11 | 2022 |
| Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints S Thekkut, R Das, M Njuki, J Li, RS Sivasubramony, FW Alshatnawi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 485-491, 2020 | 8 | 2020 |
| Current Carrying Capacity of Inkjet-Printed Nano-Silver Interconnects on Mesoporous PET Substrate EM Abbara, GS Khinda, M Alhendi, R Alhaidari, F Alshatnawi, B Garakani, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 794-800, 2022 | 5 | 2022 |
| Electrical and Mechanical Behavior of Aerosol Jet Printed Gold on Alumina Substrate for High Temperature Applications F Alshatnawi, M Alhendi, EM Abbara, R Sivasubramony, B Garakani, ... Advanced Engineering Materials, 2300439, 2023 | 4 | 2023 |
| Fabrication, Characterization, and Electromechanical Reliability of Stretchable Circuitry for Health Monitoring Systems B Garakani, KUS Somarathna, R Al-Haidari, FW Alshatnavi, DM Smilgies, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1524-1530, 2022 | 4 | 2022 |
| Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals S Khuje, F Alshatnawi, D Smilgies, M Alhendi, A Islam, J Armstrong, J Yu, ... Advanced Functional Materials 34 (4), 2311085, 2024 | 2 | 2024 |
| High‐Temperature Oxidation‐Resistant Printed Copper Conductors S Khuje, F Alshatnawi, M Alhendi, J Yu, A Sheng, Y Huang, CG Zhuang, ... Advanced Electronic Materials 9 (3), 2200979, 2023 | 2 | 2023 |
| High stability and reliability additively manufactured metal-insulator-metal capacitors for high-temperature applications F Alshatnawi, E Enakerakpo, M Alhendi, M Abdelatty, A Umar, ... Materials Today Communications 39, 108682, 2024 | 1 | 2024 |
| Modeling and Additive Manufacturing of Inductors in Complex Geometries for High Temperature Electronics WT Alshaibani, A Umar, F Alshatnawi, E Enakerakpo, MY Abdelatty, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1986-1992, 2024 | | 2024 |
| Novel SiO2 Cables With Edge Launch Connectors for High Temperature RF Measurements F Alshatnawi, A Umar, E Enakerakpo, MY Abdelatty, WT Alshaibani, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1981-1985, 2024 | | 2024 |
| Embedded RF Packaging Via Ceramic 3D Printing and Printed Electronics Additive Manufacturing AS Obeidat, A Umar, Z Dou, F Alshatnawi, R Al-Haidari, W Al-Shaibani, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 685-692, 2024 | | 2024 |
| Additively Manufactured High Temperature Electronics: Fabrication, Characterization, and Performance Assessment F Alshatnawi State University of New York at Binghamton, 2024 | | 2024 |
| Direct Write Extreme Environment Packaging D Shaddock, C Hoel, J Hale, M Poliks, M Alhendi, F Alshatnawi IMAPSource Proceedings 2022 (HiTEN), 2022 | | 2022 |
