| Method and structure to improve reliability of copper interconnects BM Basol, H Talieh US Patent 7,129,165, 2006 | 515 | 2006 |
| Chip interconnect and packaging deposition methods and structures CE Uzoh, H Talieh, B Basol US Patent 7,147,766, 2006 | 498 | 2006 |
| Fabrication of semiconductor interconnect structures BM Basol, H Talieh US Patent 7,172,497, 2007 | 495 | 2007 |
| Electrodeposited CdTe and HgCdTe solar cells BM Basol Solar Cells 23 (1-2), 69-88, 1988 | 287 | 1988 |
| Method and apparatus of sealing wafer backside for full-face electrochemical plating J Ashjaee, H Talieh, BM Basol, K Volodarsky US Patent 6,939,206, 2005 | 260 | 2005 |
| Method of sealing wafer backside for full-face electrochemical plating J Ashjaee, H Talieh, B Basol, K Volodarsky US Patent 6,855,037, 2005 | 248 | 2005 |
| High‐efficiency electroplated heterojunction solar cell BM Basol Journal of Applied Physics 55 (2), 601-603, 1984 | 241 | 1984 |
| Low cost methods for the production of semiconductor films for CuInSe2/CdS solar cells VK Kapur, BM Basol, ES Tseng Solar cells 21 (1-4), 65-72, 1987 | 221 | 1987 |
| Method of making compound semiconductor films and making related electronic devices BM Basol, VK Kapur, AT Halani, CR Leidholm, RA Roe US Patent 5,985,691, 1999 | 205 | 1999 |
| Oxide-based method of making compound semiconductor films and making related electronic devices VK Kapur, BM Basol, CR Leidholm, RA Roe US Patent 6,127,202, 2000 | 192 | 2000 |
| Electrical and optical properties of In2O3: Sn films prepared by activated reactive evaporation P Nath, RF Bunshah, BM Basol, OM Staffsud Thin Solid Films 72 (3), 463-468, 1980 | 185 | 1980 |
| Method of forming semiconductor compound film for fabrication of electronic device and film produced by same BM Basol US Patent 7,091,136, 2006 | 159 | 2006 |
| Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing J Ashjaee, BA Nagorski, BM Basol, H Talieh, C Uzoh US Patent 6,482,307, 2002 | 157 | 2002 |
| Pad designs and structures for a versatile materials processing apparatus C Uzoh, B Basol, H Talieh US Patent 6,413,388, 2002 | 146 | 2002 |
| Chip interconnect and packaging deposition methods and structures CE Uzoh, H Talieh, B Basol US Patent 6,355,153, 2002 | 141 | 2002 |
| Na in selenized Cu (In, Ga) Se2 on Na-containing and Na-free glasses: distribution, grain structure, and device performances A Rockett, JS Britt, T Gillespie, C Marshall, MM Al Jassim, F Hasoon, ... Thin Solid Films 372 (1-2), 212-217, 2000 | 137 | 2000 |
| Group I-III-VI2 semiconductor films for solar cell application BM Basol, VK Kapur US Patent 5,028,274, 1991 | 133 | 1991 |
| Technique and apparatus for depositing layers of semiconductors for solar cell and module fabrication BM Basol US Patent 7,736,940, 2010 | 125 | 2010 |
| Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence B Basol US Patent 6,534,116, 2003 | 123 | 2003 |
| Brief review of cadmium telluride-based photovoltaic technologies BM Başol, B McCandless Journal of photonics for Energy 4 (1), 040996-040996, 2014 | 119 | 2014 |
Prof. Dr. Emin BacaksızDept. of Physics, Karadeniz Technical University在 ktu.edu.tr 的电子邮件经过验证
Prof. Dr. Emin BacaksızDept. of Physics, Karadeniz Technical University在 ktu.edu.tr 的电子邮件经过验证
ALİ ÇİRİŞNiğde Ömer Halisdemir Üniversitesinde Öğretim Görevlisi在 ohu.edu.tr 的电子邮件经过验证