| Handbook of silicon based MEMS materials and technologies M Tilli, M Paulasto-Kröckel, M Petzold, H Theuss, T Motooka, V Lindroos Elsevier, 2020 | 713 | 2020 |
| Impurity and alloying effects on interfacial reaction layers in Pb-free soldering T Laurila, V Vuorinen, M Paulasto-Kröckel Materials Science and Engineering: R: Reports 68 (1-2), 1-38, 2010 | 377 | 2010 |
| The reactive route to ceramic joining: fabrication, interfacial chemistry and joint properties SD Peteves, M Paulasto, G Ceccone, V Stamos Acta Materialia 46 (7), 2407-2414, 1998 | 116 | 1998 |
| Heat generation in high power prismatic Li‐ion battery cell with LiMnNiCoO2 cathode material Y Abdul‐Quadir, T Laurila, J Karppinen, K Jalkanen, K Vuorilehto, ... International Journal of Energy Research 38 (11), 1424-1437, 2014 | 100 | 2014 |
| Chemically Stable Atomic-Layer-Deposited Al2O3 Films for Processability M Broas, O Kanninen, V Vuorinen, M Tilli, M Paulasto-Kröckel ACS omega 2 (7), 3390-3398, 2017 | 77 | 2017 |
| Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling H Chen, M Mueller, TT Mattila, J Li, X Liu, KJ Wolter, M Paulasto-Kröckel Journal of Materials Research 26 (16), 2103-2116, 2011 | 70 | 2011 |
| Thermodynamic and experimental study of Ti Ag Cu alloys M Paulasto, FJJ Van Loo, JK Kivilahti Journal of alloys and compounds 220 (1-2), 136-141, 1995 | 69 | 1995 |
| Void formation and its impact on CuSn intermetallic compound formation G Ross, V Vuorinen, M Paulasto-Kröckel Journal of Alloys and Compounds 677, 127-138, 2016 | 66 | 2016 |
| Joining silicon nitride to itself and to metals SD Peteves, G Ceccone, M Paulasto, V Stamos, PJ Yvon Jom 48, 48-52, 1996 | 62 | 1996 |
| Mechanical properties and reliability of aluminum nitride thin films E Österlund, J Kinnunen, V Rontu, A Torkkeli, M Paulasto-Kröckel Journal of Alloys and Compounds 772, 306-313, 2019 | 58 | 2019 |
| Thermal cycling reliability of Sn-Ag-Cu solder interconnections—Part 2: Failure mechanisms J Hokka, TT Mattila, H Xu, M Paulasto-Kröckel Journal of electronic materials 42, 963-972, 2013 | 58 | 2013 |
| Interfacial reactions in Ti/Si3N4 and TiN/Si diffusion couples M Paulasto, JK Kivilahti, FJJ Van Loo Journal of applied physics 77 (9), 4412-4416, 1995 | 57 | 1995 |
| Shock impact reliability and failure analysis of a three-axis MEMS gyroscope J Li, M Broas, J Makkonen, TT Mattila, J Hokka, M Paulasto-Kröckel Journal of microelectromechanical systems 23 (2), 347-355, 2013 | 55 | 2013 |
| Metallurgical reactions controlling the brazing of Al2O3 with Ag–Cu–Ti filler alloys M Paulasto, J Kivilahti Journal of materials research 13 (2), 343-352, 1998 | 54 | 1998 |
| Formation of interfacial microstructure in brazing of Si3N4 with Ti-activated Ag-Cu filler alloys M Paulasto, JK Kivilahti Scripta metallurgica et materialia 32 (8), 1209-1214, 1995 | 51 | 1995 |
| Wafer-level SLID bonding for MEMS encapsulation H Xu, T Suni, V Vuorinen, J Li, H Heikkinen, P Monnoyer, ... Advances in manufacturing 1, 226-235, 2013 | 50 | 2013 |
| Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections TT Mattila, H Xu, O Ratia, M Paulasto-Kröckel 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 44 | 2010 |
| Microstructural characterization and mechanical performance of wafer-level SLID bonded Au-Sn and Cu-Sn seal rings for MEMS encapsulation A Rautiainen, H Xu, E Österlund, J Li, V Vuorinen, M Paulasto-Kröckel Journal of Electronic Materials 44, 4533-4548, 2015 | 42 | 2015 |
| Thermal cycling reliability of Sn-Ag-Cu solder interconnections. part 1: effects of test parameters J Hokka, TT Mattila, H Xu, M Paulasto-Kröckel Journal of electronic materials 42, 1171-1183, 2013 | 41 | 2013 |
| Simulation of dynamic recrystallization in solder interconnections during thermal cycling J Li, H Xu, TT Mattila, JK Kivilahti, T Laurila, M Paulasto-Kröckel Computational Materials Science 50 (2), 690-697, 2010 | 40 | 2010 |
