| A comprehensive review of hydrogen production from methanol thermochemical conversion for sustainability G Garcia, E Arriola, WH Chen, MD De Luna Energy 217, 119384, 2021 | 230 | 2021 |
| A bibliometric review on the application of fuzzy optimization to sustainable energy technologies ER Arriola, AT Ubando, WH Chen International Journal of Energy Research 46 (1), 6-27, 2022 | 43 | 2022 |
| Impact of post-torrefaction process on biochar formation from wood pellets and self-heating phenomena for production safety E Arriola, WH Chen, YK Chih, MD De Luna, PL Show Energy 207, 118324, 2020 | 29 | 2020 |
| Wafer-level chip-scale package lead-free solder fatigue: A critical review ER Arriola, AT Ubando, JA Gonzaga, CC Lee Engineering Failure Analysis 144, 106986, 2023 | 11 | 2023 |
| Material properties sensitivity analysis based on thermomechanical analysis on warpage for ball grid array semiconductor packaging NRE Lim, E Arriola, RL Moran, JP Mercado, R Dimagiba, J Gonzaga, ... 2019 IEEE 11th International Conference on Humanoid, Nanotechnology …, 2019 | 9 | 2019 |
| Development of an energy audit working procedure for an academic university office building in the Philippines M Chan, E Arriola, R Cuevas III, JG Reyes ASEAN Engineering Journal 11 (1), 88-95, 2021 | 8 | 2021 |
| Reduction of IC package warpage through finite element analysis and direct optimization RL Moran, E Arriola, NRE Lim, JP Mercado, R Dimagiba, J Gonzaga, ... 2019 IEEE 11th International Conference on Humanoid, Nanotechnology …, 2019 | 8 | 2019 |
| Baseline model for electricity generation expansion planning for the Philippines: A leap model application BJ Nobleza, ER Arriola, MA Pedrasa International Journal on Advanced Science, Engineering and Information …, 2021 | 5 | 2021 |
| Evaluation of the effects of introducing channels to composite materials to reduce warpage on semiconductor packages due to coefficient of thermal expansion mismatch E Arriola, NRE Lim, RL Moran, JP Mercado, R Dimagiba, J Gonzaga, ... 2019 IEEE 11th International Conference on Humanoid, Nanotechnology …, 2019 | 5 | 2019 |
| Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating Z Zhang, E Arriola, C Nicholas, J Lynch, N Yun, A Morgan, W Sung, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | 3 | 2024 |
| Analysis of the effects of geometry on the press fit application in automotive power modules AT Ubando, J Gonzaga, E Arriola, RL Moran, NRE Lim, JP Mercado, ... IOP Conference Series: Materials Science and Engineering 1109 (1), 012019, 2021 | 3 | 2021 |
| Drop test analysis of ball grid array package using finite element method J Gonzaga, AT Ubando, E Arriola, RL Moran, NRE Lim, JP Mercado, ... IOP Conference Series: Materials Science and Engineering 1109 (1), 012023, 2021 | 2 | 2021 |
| Packaging of 20 kV double-side cooled silicon carbide diode module with electrical insulation enhanced by a polymer-nanoparticle coating Z Zhang, C Nicholas, A Emmanuel, KDT Ngo, GQ Lu, J Lynch, N Yun, ... 2023 25th European Conference on Power Electronics and Applications (EPE'23 …, 2023 | 1 | 2023 |
| Sliding speed effect in press-fit connection using Finite Element Analysis AT Ubando, J Gonzaga, D Belarmino, E Arriola, NRE Lim, RL Moran, ... IOP Conference Series: Materials Science and Engineering 1109 (1), 012034, 2021 | 1 | 2021 |
| Double-Sided Cooling Half-Bridge Power Module of 650 V/150 A Gallium Nitride High-Electron-Mobility Transistor S Lu, B Li, E Arriola, Z Zhang, C Nicholas, KDT Ngo, GQ Lu IEEE Transactions on Industrial Electronics, 2024 | | 2024 |
| Accelerated Voltage Endurance Test and Insulation Lifetime Estimation of Silicone-Gel Encapsulated Direct-Bond-Copper Substrates for Medium-Voltage Power Module Packaging Y Gao, Z Zhang, Z Zintak, E Arriola, TS Aunsborg, S Munk-Nielsen, GQ Lu CIPS 2024; 13th International Conference on Integrated Power Electronics …, 2024 | | 2024 |
| Double-Side Cooled 1.2 kV, 300A SiC MOSFET Phase-leg Modules for 200 kW,> 100 kW/L Traction Inverters Z Zhang, GQ Lu, X Zhao, D Dong, E Arriola, A Ubando, Y Gao CIPS 2024; 13th International Conference on Integrated Power Electronics …, 2024 | | 2024 |
| Thermo-Mechanical Analysis of a 650 V/150 A e-GaN HEMT Sandwiched Between a PCB and DBC Substrate C Nicholas, F Boshkovski, E Arriola, Z Zhang, GQ Lu 2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA …, 2023 | | 2023 |
| Effects of Pores on Crack Propagation in Sintered-Silver Die Attach: A Baseline Model E Arriola, GQ Lu, A Ubando International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | | 2023 |
| Exploring simplification methods in reducing simulation time for drop test analysis AT Ubando, J Gonzaga, NRE Lim, JP Mercado, E Arriola, RL Moran, ... IOP Conference Series: Materials Science and Engineering 1109 (1), 012026, 2021 | | 2021 |
