| Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology KN Tu, Y Liu Materials Science and Engineering: R: Reports 136, 1-12, 2019 | 149 | 2019 |
| Effect of Joule heating and current crowding on electromigration in mobile technology KN Tu, Y Liu, M Li Applied Physics Reviews 4 (1), 2017 | 139 | 2017 |
| Low melting point solders based on Sn, Bi, and In elements Y Liu, KN Tu Materials Today Advances 8, 100115, 2020 | 130 | 2020 |
| Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter Y Liu, YC Chu, KN Tu Acta Materialia 117, 146-152, 2016 | 118 | 2016 |
| Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5 D integrated circuits Y Liu, M Li, DW Kim, S Gu, KN Tu Journal of Applied Physics 118 (13), 2015 | 53 | 2015 |
| Atomic insights of cu nanoparticles melting and sintering behavior in cucu direct bonding R Wu, X Zhao, Y Liu Materials & Design 109240, 2020 | 38 | 2020 |
| A high-entropy alloy as very low melting point solder for advanced electronic packaging Y Liu, L Pu, Y Yang, Q He, Z Zhou, C Tan, X Zhao, Q Zhang, KN Tu Materials Today Advances 7, 100101, 2020 | 38 | 2020 |
| Fracture reliability concern of (Au, Ni) Sn4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing Y Liu, YT Chen, S Gu, DW Kim, KN Tu Scripta Materialia 119, 9-12, 2016 | 23 | 2016 |
| A metastable phase of tin in 3D integrated circuit solder microbumps Y Liu, N Tamura, DW Kim, S Gu, KN Tu Scripta Materialia 102, 39-42, 2015 | 23 | 2015 |
| Growth behavior and reliability of interfacial IMC for Sn58Bi/Cu and Sn58Bi–AlN/Cu solder joints applied in IGBT modules X Wang, L Zhang, X Wang, Y Guo, L Sun, Y Liu, C Chen, X Lu Journal of Materials Research and Technology 21, 4263-4280, 2022 | 19 | 2022 |
| Effects of minor alloying with Ge and In on the interfacial microstructure between Zn–Sn solder alloy and Cu substrate Y Wei, Y Liu, X Zhao, C Tan, Y Dong, J Zhang Journal of Alloys and Compounds 831, 154812, 2020 | 19 | 2020 |
| Joule heating enhanced electromigration failure in redistribution layer in 2.5 D IC Y Liu, M Li, M Jiang, DW Kim, S Gu, KN Tu 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1359-1363, 2016 | 16 | 2016 |
| Electromigration in three-dimensional integrated circuits Z Shen, S Jing, Y Heng, Y Yao, KN Tu, Y Liu Applied Physics Reviews 10 (2), 2023 | 14 | 2023 |
| Interconnect quality and reliability of 3D packaging Y Wang, Y Liu, M Li, KN Tu, L Xu 3D Microelectronic Packaging: From Fundamentals to Applications, 375-420, 2017 | 14 | 2017 |
| Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation L Pu, Y Liu, Y Yang, Q He, Z Zhou, X Zhao, C Tan, KN Tu Materials Letters 272, 127891, 2020 | 13 | 2020 |
| Low temperature interfacial reaction in 3D IC nanoscale materials Y Liu, Y Lu, KN Tu Materials Science and Engineering: R: Reports 151, 100701, 2022 | 10 | 2022 |
| Ultra-thin intermetallic compound formation in microbump technology by the control of a low Zn concentration in solder Y Liu, L Pu, A Gusak, X Zhao, C Tan, KN Tu Materialia 12, 100791, 2020 | 10 | 2020 |
| The effect of Ag on the growth of intermetallics at the interface of Sn5Zn/Cu interconnects J Guo, X Zhao, Y Liu, C Tan, L Liu, X Ning, Z Nie, X Yu Materials Today Communications 24, 100960, 2020 | 9 | 2020 |
| The microstructure and mechanical property of the high entropy alloy as a low temperature solder L Pu, Q He, Y Yang, X Zhao, Z Hou, KN Tu, Y Liu 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1716-1721, 2019 | 8 | 2019 |
| Fast prediction of electromigration lifetime with modified mean-time-to-failure equation Y Liu, A Gusak, S Jing, KN Tu Materials Letters 325, 132880, 2022 | 7 | 2022 |
Yong Yang (楊勇)Professor, Department of Mechanical Engineering, City University of Hong Kong在 cityu.edu.hk 的电子邮件经过验证
