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junsong Hu
junsong Hu
在 stu.hit.edu.cn 的电子邮件经过验证
标题
引用次数
引用次数
年份
Morphology and mechanical properties of polyimide films: the effects of UV irradiation on microscale surface
C Qu, J Hu, X Liu, Z Li, Y Ding
Materials 10 (11), 1329, 2017
732017
Crack growth behavior and thermal shock resistance of ceramic sandwich structures with an auxetic honeycomb core
JS Hu, BL Wang
Composite Structures 260, 113256, 2021
452021
Thermal shock resistance behavior of auxetic ceramic honeycombs with a central crack or an edge crack
JS Hu, BL Wang, JE Li, KF Wang
Ceramics International 46 (8), 11835-11845, 2020
312020
Enhanced fatigue performance of auxetic honeycomb/substrate structures under thermal cycling
JS Hu, BL Wang
International Journal of Mechanical Sciences 199, 106432, 2021
222021
Thermal shock fracture analysis of auxetic honeycomb layer based on non-Fourier heat conduction
JS Hu, BL Wang, H Hirakata, KF Wang
Engineering Structures 279, 115581, 2023
122023
Strain engineering on transmission carriers of monolayer phosphorene
W Zhang, F Li, J Hu, P Zhang, J Yin, X Tang, Y Jiang, B Wu, Y Ding
Journal of Physics: Condensed Matter 29 (46), 465501, 2017
102017
Thermal shock resistance enhancement of auxetic honeycomb layer considering multi-cracking and temperature-dependent material properties
JS Hu, BL Wang, JE Li, Z Li
International Communications in Heat and Mass Transfer 135, 106072, 2022
82022
Interfacial thermal damage and fatigue between auxetic honeycomb sandwich and underneath substrate
JS Hu, BL Wang, H Hirakata, Z Li
International Journal of Solids and Structures 279, 112364, 2023
52023
Nonlocal model of electromechanical fields and effective properties of piezoelectric materials with rigid and electrically conductive inclusions
BL Wang, JS Hu, L Zheng
Mechanics of Materials 176, 104415, 2023
42023
Non-Fourier heat conduction induced thermal shock fracture behavior of multi-crack auxetic honeycomb structures
J Hu, B Wang, Y Yang, D Xie
Applied Mathematics and Mechanics 45 (12), 2093-2112, 2024
2024
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