Morphology and mechanical properties of polyimide films: the effects of UV irradiation on microscale surface C Qu, J Hu, X Liu, Z Li, Y Ding Materials 10 (11), 1329, 2017 | 73 | 2017 |
Crack growth behavior and thermal shock resistance of ceramic sandwich structures with an auxetic honeycomb core JS Hu, BL Wang Composite Structures 260, 113256, 2021 | 45 | 2021 |
Thermal shock resistance behavior of auxetic ceramic honeycombs with a central crack or an edge crack JS Hu, BL Wang, JE Li, KF Wang Ceramics International 46 (8), 11835-11845, 2020 | 31 | 2020 |
Enhanced fatigue performance of auxetic honeycomb/substrate structures under thermal cycling JS Hu, BL Wang International Journal of Mechanical Sciences 199, 106432, 2021 | 22 | 2021 |
Thermal shock fracture analysis of auxetic honeycomb layer based on non-Fourier heat conduction JS Hu, BL Wang, H Hirakata, KF Wang Engineering Structures 279, 115581, 2023 | 12 | 2023 |
Strain engineering on transmission carriers of monolayer phosphorene W Zhang, F Li, J Hu, P Zhang, J Yin, X Tang, Y Jiang, B Wu, Y Ding Journal of Physics: Condensed Matter 29 (46), 465501, 2017 | 10 | 2017 |
Thermal shock resistance enhancement of auxetic honeycomb layer considering multi-cracking and temperature-dependent material properties JS Hu, BL Wang, JE Li, Z Li International Communications in Heat and Mass Transfer 135, 106072, 2022 | 8 | 2022 |
Interfacial thermal damage and fatigue between auxetic honeycomb sandwich and underneath substrate JS Hu, BL Wang, H Hirakata, Z Li International Journal of Solids and Structures 279, 112364, 2023 | 5 | 2023 |
Nonlocal model of electromechanical fields and effective properties of piezoelectric materials with rigid and electrically conductive inclusions BL Wang, JS Hu, L Zheng Mechanics of Materials 176, 104415, 2023 | 4 | 2023 |
Non-Fourier heat conduction induced thermal shock fracture behavior of multi-crack auxetic honeycomb structures J Hu, B Wang, Y Yang, D Xie Applied Mathematics and Mechanics 45 (12), 2093-2112, 2024 | | 2024 |